| Patent | Date |
|---|
Semiconductor Package With Redistribution Structure And Manufacturing Method Thereof
App 20220093526 - Wu; Wei-Cheng ; et al. | 2022-03-24 |
Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof
Grant 11,195,802 - Wu , et al. December 7, 2 | 2021-12-07 |
3D Packages and Methods for Forming the Same
App 20210313196 - Chiu; Tzu-Wei ; et al. | 2021-10-07 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305122 - Lai; Wei-Chih ; et al. | 2021-09-30 |
3D packages and methods for forming the same
Grant 11,069,539 - Chiu , et al. July 20, 2 | 2021-07-20 |
Method for forming package structure
Grant 11,069,625 - Hsieh , et al. July 20, 2 | 2021-07-20 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20210193618 - Hsieh; Cheng-Hsien ; et al. | 2021-06-24 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20210185810 - Hsieh; Cheng-Hsien ; et al. | 2021-06-17 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 11,018,088 - Hsieh , et al. May 25, 2 | 2021-05-25 |
Semiconductor Package And Manufacturing Method Thereof
App 20210098391 - Wu; Wei-Cheng ; et al. | 2021-04-01 |
Semiconductor Device and Method of Manufacture
App 20210082845 - Hsieh; Cheng-Hsien ; et al. | 2021-03-18 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,950,577 - Hsieh , et al. March 16, 2 | 2021-03-16 |
Opening in the pad for bonding integrated passive device in InFO package
Grant 10,939,551 - Hsieh , et al. March 2, 2 | 2021-03-02 |
Dummy metal with zigzagged edges
Grant 10,867,900 - Hsieh , et al. December 15, 2 | 2020-12-15 |
Semiconductor device and method of manufacture
Grant 10,833,030 - Hsieh , et al. November 10, 2 | 2020-11-10 |
Semiconductor Package and Method of Forming the Same
App 20200343193 - Hsieh; Cheng-Hsien ; et al. | 2020-10-29 |
Semiconductor structure and method for preparing the same
Grant 10,818,800 - Hsieh , et al. October 27, 2 | 2020-10-27 |
Semiconductor structure
Grant 10,763,212 - Hsieh , et al. Sep | 2020-09-01 |
3D Packages and Methods for Forming the Same
App 20200266076 - Chiu; Tzu-Wei ; et al. | 2020-08-20 |
Semiconductor package and method of forming the same
Grant 10,714,426 - Hsieh , et al. | 2020-07-14 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,700,045 - Hsieh , et al. | 2020-06-30 |
3D packages and methods for forming the same
Grant 10,665,474 - Chiu , et al. | 2020-05-26 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,629,537 - Hsieh , et al. | 2020-04-21 |
Dummy Metal with Zigzagged Edges
App 20200083156 - Hsieh; Cheng-Hsien ; et al. | 2020-03-12 |
Surface Mount Device/Integrated Passive Device on Package or Device Structure and Methods of Forming
App 20200075563 - Hsieh; Cheng-Hsien ; et al. | 2020-03-05 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20200058616 - Hsieh; Cheng-Hsien ; et al. | 2020-02-20 |
Dummy metal with zigzagged edges
Grant 10,510,654 - Hsieh , et al. Dec | 2019-12-17 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,504,877 - Hsieh , et al. Dec | 2019-12-10 |
Package structures and method of forming the same
Grant 10,504,751 - Chen , et al. Dec | 2019-12-10 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,475,768 - Hsieh , et al. Nov | 2019-11-12 |
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same
App 20190295955 - Hsieh; Cheng-Hsien ; et al. | 2019-09-26 |
Optimization of source and bandwidth for new and existing patterning devices
Grant 10,416,566 - Conley , et al. Sept | 2019-09-17 |
Semiconductor Device and Method of Manufacture
App 20190252334 - Hsieh; Cheng-Hsien ; et al. | 2019-08-15 |
3D Packages and Methods for Forming the Same
App 20190221445 - Chiu; Tzu-Wei ; et al. | 2019-07-18 |
Semiconductor Structure And Method For Preparing The Same
App 20190198676 - HSIEH; CHENG-HSIEN ; et al. | 2019-06-27 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 10,319,681 - Hsieh , et al. | 2019-06-11 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,290,584 - Hsieh , et al. | 2019-05-14 |
Method For Forming Package Structure
App 20190131249 - HSIEH; Cheng-Hsien ; et al. | 2019-05-02 |
Three-dimensional chip stack and method of forming the same
Grant 10,276,532 - Chen , et al. | 2019-04-30 |
Dummy Metal with Zigzagged Edges
App 20190122975 - Hsieh; Cheng-Hsien ; et al. | 2019-04-25 |
3D packages and methods for forming the same
Grant 10,269,584 - Chiu , et al. | 2019-04-23 |
Semiconductor device and method of manufacture
Grant 10,269,738 - Hsieh , et al. | 2019-04-23 |
Conductive Vias in Semiconductor Packages and Methods of Forming Same
App 20190115299 - Hsieh; Cheng-Hsien ; et al. | 2019-04-18 |
Surface Mount Device/integrated Passive Device On Package Or Device Structure And Methods Of Forming
App 20190096860 - Hsieh; Cheng-Hsien ; et al. | 2019-03-28 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20190098756 - Hsieh; Cheng-Hsien ; et al. | 2019-03-28 |
Package structure and method for forming the same
Grant 10,163,805 - Hsieh , et al. Dec | 2018-12-25 |
Opening in the pad for bonding integrated passive device in InFO package
Grant 10,165,682 - Hsieh , et al. Dec | 2018-12-25 |
Semiconductor Package and Method of Forming the Same
App 20180366412 - Hsieh; Cheng-Hsien ; et al. | 2018-12-20 |
Dummy metal with zigzagged edges
Grant 10,157,825 - Hsieh , et al. Dec | 2018-12-18 |
Conductive Vias In Semiconductor Packages And Methods Of Forming Same
App 20180350745 - Hsieh; Cheng-Hsien ; et al. | 2018-12-06 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,141,288 - Hsieh , et al. Nov | 2018-11-27 |
Package Structures and Method of Forming the Same
App 20180330969 - Chen; Hsien-Wei ; et al. | 2018-11-15 |
Under bump metallurgy (UBM) and methods of forming same
Grant 10,109,607 - Chen , et al. October 23, 2 | 2018-10-23 |
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same
App 20180294228 - Hsieh; Cheng-Hsien ; et al. | 2018-10-11 |
Semiconductor package and method of forming the same
Grant 10,062,648 - Hsieh , et al. August 28, 2 | 2018-08-28 |
Semiconductor Device and Method of Manufacture
App 20180218989 - Hsieh; Cheng-Hsien ; et al. | 2018-08-02 |
Package structures and method of forming the same
Grant 10,032,651 - Chen , et al. July 24, 2 | 2018-07-24 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 9,997,464 - Hsieh , et al. June 12, 2 | 2018-06-12 |
Semiconductor device and method of manufacture
Grant 9,929,112 - Hsieh , et al. March 27, 2 | 2018-03-27 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20180076175 - Hsieh; Cheng-Hsien ; et al. | 2018-03-15 |
Under Bump Metallurgy (UBM) And Methods Of Forming Same
App 20180026002 - Chen; Wei-Yu ; et al. | 2018-01-25 |
Package Structure And Method For Forming The Same
App 20180005955 - HSIEH; Cheng-Hsien ; et al. | 2018-01-04 |
Integrated fan-out package, semiconductor device, and method of fabricating the same
Grant 9,812,426 - Wang , et al. November 7, 2 | 2017-11-07 |
Dummy Features In Redistribution Layers (rdls) And Methods Of Forming Same
App 20170317029 - Hsieh; Cheng-Hsien ; et al. | 2017-11-02 |
Three-Dimensional Chip Stack and Method of Forming the Same
App 20170301641 - Chen; Wei-Ming ; et al. | 2017-10-19 |
Under bump metallurgy (UBM) and methods of forming same
Grant 9,793,231 - Chen , et al. October 17, 2 | 2017-10-17 |
Semiconductor Package And Method Of Forming The Same
App 20170250138 - Hsieh; Cheng-Hsien ; et al. | 2017-08-31 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 9,741,690 - Hsieh , et al. August 22, 2 | 2017-08-22 |
Three-dimensional chip stack and method of forming the same
Grant 9,698,115 - Chen , et al. July 4, 2 | 2017-07-04 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20170188458 - Hsieh; Cheng-Hsien ; et al. | 2017-06-29 |
Semiconductor device
Grant 9,640,496 - Chen , et al. May 2, 2 | 2017-05-02 |
Package structures and methods of forming the same
Grant 9,627,288 - Chen , et al. April 18, 2 | 2017-04-18 |
Semiconductor Device and Method of Manufacture
App 20170092604 - Hsieh; Cheng-Hsien ; et al. | 2017-03-30 |
Semiconductor Device
App 20170084556 - CHEN; WEI-YU ; et al. | 2017-03-23 |
Dummy Metal with Zigzagged Edges
App 20170084529 - Hsieh; Cheng-Hsien ; et al. | 2017-03-23 |
Smd/ipd On Package Or Device Structure And Methods Of Forming
App 20170033090 - Hsieh; Cheng-Hsien ; et al. | 2017-02-02 |
Under Bump Metallurgy (ubm) And Methods Of Forming Same
App 20170005052 - Chen; Wei-Yu ; et al. | 2017-01-05 |
Package Structures And Methods Of Forming The Same
App 20160351463 - Chen; Hsien-Wei ; et al. | 2016-12-01 |
Dummy metal with zigzagged edges
Grant 9,502,343 - Hsieh , et al. November 22, 2 | 2016-11-22 |
Three-Dimensional Chip Stack and Method of Forming the Same
App 20160276315 - Chen; Wei-Ming ; et al. | 2016-09-22 |
Package Structures and Method of Forming the Same
App 20160240391 - Chen; Hsien-Wei ; et al. | 2016-08-18 |
3D Packages and Methods for Forming the Same
App 20160181124 - Chiu; Tzu-Wei ; et al. | 2016-06-23 |
Three-dimensional chip stack and method of forming the same
Grant 9,355,980 - Chen , et al. May 31, 2 | 2016-05-31 |
3D packages and methods for forming the same
Grant 9,299,649 - Chiu , et al. March 29, 2 | 2016-03-29 |
Assembled Wearable Electronic Device
App 20150130666 - Pan; Hung-Sung ; et al. | 2015-05-14 |
Three-Dimensional Chip Stack and Method of Forming the Same
App 20150061118 - Chen; Wei-Ming ; et al. | 2015-03-05 |
Catalytic Article and Method for Preparing the Same
App 20140274669 - Liu; Bo-Tau ; et al. | 2014-09-18 |
3D Packages and Methods for Forming the Same
App 20140225258 - Chiu; Tzu-Wei ; et al. | 2014-08-14 |
Catalytic Article for Decomposing Volatile Organic Compound and Method for Preparing the Same
App 20140087937 - Liu; Bo-Tau ; et al. | 2014-03-27 |
Blood pressure monitor
Grant D577,440 - Ferber , et al. September 23, 2 | 2008-09-23 |
Blood pressure monitor
Grant D562,457 - Ferber , et al. February 19, 2 | 2008-02-19 |
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