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Patent applications and USPTO patent grants for HSIEH; Chang-Yu.The latest application filed is for "heat dissipation device".
Patent | Date |
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Heat Dissipation Device App 20220299277 - LIN; Chia-Yu ;   et al. | 2022-09-22 |
Heat dissipation device Grant 11,384,999 - Lin , et al. July 12, 2 | 2022-07-12 |
Heat Dissipation Structure App 20210088288 - WANG; Chi-Chuan ;   et al. | 2021-03-25 |
Heat dissipation structure Grant 10,907,907 - Wang , et al. February 2, 2 | 2021-02-02 |
Heat Dissipation Device App 20200378698 - LIN; Chia-Yu ;   et al. | 2020-12-03 |
Heat Dissipation Structure App 20190195567 - WANG; Chi-Chuan ;   et al. | 2019-06-27 |
Computer device and method for converting working mode of universal serial bus connector of the computer device Grant 9,557,791 - Hsieh , et al. January 31, 2 | 2017-01-31 |
Computer Device And Method For Converting Working Mode Of Universal Serial Bus Connector Of The Computer Device App 20150082056 - Hsieh; Chang-Yu ;   et al. | 2015-03-19 |
Transmission Interface System With Detection Function And Method App 20140201420 - HSIEH; Chang-Yu ;   et al. | 2014-07-17 |
Charging Management Method, Charging Control Circuit And The Host Apparatus Having The Same App 20120096286 - Huang; Pai-Ching ;   et al. | 2012-04-19 |
Module Cover Assembly With Door Latch Transmission Mechanism For Wafer Transport Module App 20020134784 - Hsieh, Chang Yu ;   et al. | 2002-09-26 |
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