Hsieh; Chang-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsieh; Chang-Lin.The latest application filed is for "hdmi apparatus using optical communication".

Company Profile

3.15.18

Hsieh; Chang-Lin - Hsinchu County TW
Hsieh; Chang-Lin - Chiayi County TW
Hsieh; Chang-Lin - Taipei TW
Hsieh; Chang-Lin - San Jose CA
Hsieh; Chang-Lin - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
HDMI apparatus using optical communication Grant 11,240,554 - Lin , et al. February 1, 2	2022-02-01
HDMI Apparatus Using Optical Communication App 20210314656 - Lin; Shao-Hung ; et al.	2021-10-07
HDMI apparatus using optical communication Grant 11,039,202 - Lin , et al. June 15, 2	2021-06-15
Optical Module And Projection Apparatus App 20210026230 - Liu; Chien-Sheng ; et al.	2021-01-28
Hdmi Apparatus Using Optical Communication App 20200359084 - Lin; Shao-Hung ; et al.	2020-11-12
Charging-discharging module of energy storage unit and charging-discharging method thereof Grant 10,630,101 - Hsieh , et al.	2020-04-21
Charging-discharging Module Of Energy Storage Unit And Charging-discharging Method Thereof App 20180069428 - HSIEH; Chang-Lin ; et al.	2018-03-08
Plasma etching carbonaceous layers with sulfur-based etchants Grant 8,133,819 - Wang , et al. March 13, 2	2012-03-13
In-situ Clean To Reduce Metal Residues After Etching Titanium Nitride App 20110130007 - CHING; CHI-HONG ; et al.	2011-06-02
Chamber Plasma-cleaning Process Scheme App 20100024840 - HSIEH; CHANG-LIN ; et al.	2010-02-04
Method of etching an organic low-k dielectric material Grant 7,585,778 - Hsieh , et al. September 8, 2	2009-09-08
Plasma Etching Carbonaceous Layers With Sulfur-based Etchants App 20090212010 - Wang; Judy ; et al.	2009-08-27
Method For Fabricating Low K Dielectric Dual Damascene Structures App 20090156012 - HSIEH; CHANG-LIN ; et al.	2009-06-18
Method Of Etching An Organic Low-k Dielectric Material App 20080237183 - HSIEH; CHANG-LIN ; et al.	2008-10-02
Dielectric Etch Tool Configured For High Density And Low Bombardment Energy Plasma Providing High Etch Rates App 20080023144 - Delgadino; Gerardo A. ; et al.	2008-01-31
BARC shaping for improved fabrication of dual damascene integrated circuit features Grant 7,071,112 - Hsieh , et al. July 4, 2	2006-07-04
Dielectric etch method with high source and low bombardment plasma providing high etch rates App 20060118519 - Delgadino; Gerardo A. ; et al.	2006-06-08
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,949,203 - Hsieh , et al. September 27, 2	2005-09-27
Process for selectively etching dielectric layers Grant 6,905,968 - Hsieh , et al. June 14, 2	2005-06-14
Selective etching of low-k dielectrics Grant 6,897,154 - Leung , et al. May 24, 2	2005-05-24
Etch process for dielectric materials comprising oxidized organo silane materials Grant 6,762,127 - Boiteux , et al. July 13, 2	2004-07-13
Barc shaping for improved fabrication of dual damascene integrated circuit features App 20040077175 - Hsieh, Chang-Lin ; et al.	2004-04-22
Selective etching of low-k dielectrics App 20030235993 - Leung, Terry ; et al.	2003-12-25
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene App 20030164354 - Hsieh, Chang-Lin ; et al.	2003-09-04
Method of etching carbon-containing silicon oxide films Grant 6,607,675 - Hsieh , et al. August 19, 2	2003-08-19
Process for selectively etching dielectric layers App 20030109143 - Hsieh, Chang-Lin ; et al.	2003-06-12
Monitoring substrate processing with optical emission and polarized reflected radiation Grant 6,559,942 - Sui , et al. May 6, 2	2003-05-06
Etch process for dielectric materials comprising oxidized organo silane materials App 20030073321 - Boiteux, Yves Pierre ; et al.	2003-04-17
Method of heating a semiconductor substrate Grant 6,547,978 - Ye , et al. April 15, 2	2003-04-15
NH3 plasma descumming and resist stripping in semiconductor applications Grant 6,455,431 - Hsieh , et al. September 24, 2	2002-09-24
Monitoring substrate processing with optical emission and polarized reflected radiation App 20020048019 - Sui, Zhifeng ; et al.	2002-04-25
Method of heating a semiconductor substrate App 20020045354 - Ye, Yan ; et al.	2002-04-18
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion Grant 6,153,530 - Ye , et al. November 28, 2	2000-11-28

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