Hsiau; Feng-Ger
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsiau; Feng-Ger.The latest application filed is for "method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package".
- Hsiau; Feng-Ger - Nantou Hsien TW
| Patent | Date |
|---|---|
| Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package Grant 7,222,419 - Horng , et al. May 29, 2 | 2007-05-29 |
| Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package App 20040045656 - Horng, Gwo-Ji ; et al. | 2004-03-11 |
| Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package App 20030110629 - Horng, Gwo-Ji ; et al. | 2003-06-19 |
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