HSIAO; Wen-Chu

Patent Applications and Registrations

Patent applications and USPTO patent grants for HSIAO; Wen-Chu.The latest application filed is for "semiconductor device and manufacturing method thereof".

Company Profile

5.20.22

HSIAO; Wen-Chu - Tainan City TW
Hsiao; Wen-Chu - Tainan TW
Hsiao; Wen-Chu - Jung-Li TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Manufacturing Method Thereof App 20220238709 - LI; Kun-Mu ; et al.	2022-07-28
Contact structure for FinFET semiconductor device Grant 11,309,418 - Li , et al. April 19, 2	2022-04-19
Method for Increasing Germanium Concentration of Fin and Resulting Semiconductor Device App 20210273080 - Lin; Che-Yu ; et al.	2021-09-02
Fin field-effect transistor device and method of forming the same Grant 11,088,028 - Lin , et al. August 10, 2	2021-08-10
Fin Field-Effect Transistor Device and Method of Forming the Same App 20210159122 - Lin; Che-Yu ; et al.	2021-05-27
Method for increasing germanium concentration of FIN and resulting semiconductor device Grant 11,011,623 - Lin , et al. May 18, 2	2021-05-18
Semiconductor Structure With Blocking Layer App 20210119037 - LI; Kun-Mu ; et al.	2021-04-22
Semiconductor structure with blocking layer and method for forming the same Grant 10,868,181 - Li , et al. December 15, 2	2020-12-15
Source and drain epitaxy re-shaping Grant 10,727,131 - Li , et al.	2020-07-28
Fin Field-effect Transistor Device And Method Of Forming The Same App 20200176319 - Lin; Che-Yu ; et al.	2020-06-04
Semiconductor Device and Method App 20200006530 - Lin; Che-Yu ; et al.	2020-01-02
Semiconductor Device And Manufacturing Method Thereof App 20190280115 - LI; Kun-Mu ; et al.	2019-09-12
Method of forming a contact structure for a FinFET semiconductor device Grant 10,297,690 - Li , et al.	2019-05-21
Method of fabricating a semiconductor device structure Grant 10,269,648 - Li , et al.	2019-04-23
Semiconductor Structure With Blocking Layer And Method For Forming The Same App 20190097006 - LI; Kun-Mu ; et al.	2019-03-28
Source And Drain Epitaxy Re-shaping App 20180366373 - LI; Kun-Mu ; et al.	2018-12-20
Semiconductor Device And Manufacturing Method Thereof App 20180190810 - LI; Kun-Mu ; et al.	2018-07-05
Semiconductor device Grant 9,735,271 - Hsiao , et al. August 15, 2	2017-08-15
Surface tension modification using silane with hydrophobic functional group for thin film deposition Grant 9,698,263 - Chong , et al. July 4, 2	2017-07-04
Semiconductor devices utilizing partially doped stressor film portions Grant 9,634,119 - Hsiao , et al. April 25, 2	2017-04-25
Semiconductor device and manufacturing method thereof Grant 9,543,387 - Chang , et al. January 10, 2	2017-01-10
Surface Tension Modification Using Silane With Hydrophobic Functional Group For Thin Film Deposition App 20160190320 - CHONG; Lai-Wan ; et al.	2016-06-30
Semiconductor Device App 20160181427 - HSIAO; Wen Chu ; et al.	2016-06-23
Semiconductor device Grant 9,324,863 - Hsiao , et al. April 26, 2	2016-04-26
Surface tension modification using silane with hydrophobic functional group for thin film deposition Grant 9,214,393 - Chong , et al. December 15, 2	2015-12-15
Semiconductor Devices Utilizing Partially Doped Stressor Film Portions App 20150311314 - Hsiao; Wen Chu ; et al.	2015-10-29
Semiconductor Device And Manufacturing Method Thereof App 20150255578 - CHANG; SHIH-CHIEH ; et al.	2015-09-10
Semiconductor devices utilizing partially doped stressor film portions and methods for forming the same Grant 9,064,892 - Hsiao , et al. June 23, 2	2015-06-23
Dual damascene metal gate Grant 8,927,406 - Wang , et al. January 6, 2	2015-01-06
Semiconductor device App 20140239416 - HSIAO; Wen Chu ; et al.	2014-08-28
Dual Damascene Metal Gate App 20140191299 - Wang; Chun-Chieh ; et al.	2014-07-10
Method of manufacturing semiconductor device Grant 8,735,255 - Hsiao , et al. May 27, 2	2014-05-27
Method Of Manufacturing Semiconductor Device App 20130295739 - HSIAO; Wen Chu ; et al.	2013-11-07
Surface Tension Modification Using Silane With Hydrophobic Functional Group For Thin Film Deposition App 20130256663 - CHONG; Lai Wan ; et al.	2013-10-03
Semiconductor Devices Utilizing Partially Doped Stressor Film Portions And Methods For Forming The Same App 20130049101 - HSIAO; Wen Chu ; et al.	2013-02-28
Method for using ammonium fluoride solution in a photoelectrochemical etching process of a silicon wafer Grant 6,852,643 - Lin , et al. February 8, 2	2005-02-08

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