| Patent | Date |
|---|
Safety Protection Device And Method For Battery Test System
App 20220285803 - HSIAO; WEI-MIN ; et al. | 2022-09-08 |
External battery short-circuit testing device
Grant 11,169,212 - Hsiao , et al. November 9, 2 | 2021-11-09 |
External Battery Short-Circuit Testing Device
App 20210215761 - Hsiao; Wei-Min ; et al. | 2021-07-15 |
Charging method for battery set and battery management system using the same
Grant 10,594,143 - Hsiao , et al. | 2020-03-17 |
Charging control apparatus, charging control method and computer readable medium thereof
Grant 10,536,020 - Hsiao , et al. Ja | 2020-01-14 |
Link reestablishment method and electrical system using the same
Grant 10,404,527 - Hsiao , et al. Sep | 2019-09-03 |
Range extending apparatus for electric vehicle and control method thereof
Grant 10,377,262 - Hsiao , et al. A | 2019-08-13 |
Charging Method For Battery Set And Battery Management System Using The Same
App 20190181654 - HSIAO; WEI-MIN ; et al. | 2019-06-13 |
Link Reestablishment Method And Electrical System Using The Same
App 20190182102 - HSIAO; WEI-MIN ; et al. | 2019-06-13 |
Charging Control Apparatus, Charging Control Method And Computer Readable Medium Thereof
App 20190123565 - HSIAO; WEI-MIN ; et al. | 2019-04-25 |
Battery active balancing system
Grant 10,063,070 - Hsiao , et al. August 28, 2 | 2018-08-28 |
Range Extending Apparatus For Electric Vehicle And Control Method Thereof
App 20180154794 - HSIAO; WEI-MIN ; et al. | 2018-06-07 |
Battery Active Balancing System
App 20180152028 - HSIAO; WEI-MIN ; et al. | 2018-05-31 |
Semiconductor package structure and method for manufacturing the same
Grant 9,929,078 - Lu , et al. March 27, 2 | 2018-03-27 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20170207151 - LU; Wen-Long ; et al. | 2017-07-20 |
Method And Apparatus Of Detecting States Of Battery
App 20160178706 - LIU; CHIH-PENG ; et al. | 2016-06-23 |
Carrier bonding and detaching processes for a semiconductor wafer
Grant 8,975,157 - Hsiao March 10, 2 | 2015-03-10 |
Carrier bonding and detaching processes for a semiconductor wafer
Grant 8,865,520 - Yang , et al. October 21, 2 | 2014-10-21 |
Carrier Bonding And Detaching Processes For A Semiconductor Wafer
App 20130203265 - Hsiao; Wei-Min | 2013-08-08 |
Packaging structure and method of a MEMS microphone
Grant 8,194,896 - Hsiao June 5, 2 | 2012-06-05 |
Carrier Bonding And Detaching Processes For A Semiconductor Wafer
App 20120052654 - Yang; Kuo-Pin ; et al. | 2012-03-01 |
Wafer polishing method
Grant 8,053,367 - Hsiao November 8, 2 | 2011-11-08 |
MEMS microphone package and method thereof
Grant 7,829,961 - Hsiao November 9, 2 | 2010-11-09 |
MEMS microphone module and method thereof
Grant 7,808,060 - Hsiao October 5, 2 | 2010-10-05 |
Sawing method for a semiconductor element with a microelectromechanical system
Grant 7,674,688 - Hsiao March 9, 2 | 2010-03-09 |
Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
Grant 7,573,124 - Wang , et al. August 11, 2 | 2009-08-11 |
Wafer Having Heat Dissipation Structure And Method Of Fabricating The Same
App 20090189255 - Hsiao; Wei-Min | 2009-07-30 |
Method for encapsulating sensor chips
Grant 7,563,652 - Yang , et al. July 21, 2 | 2009-07-21 |
Package optical chip with conductive pillars
Grant 7,560,744 - Hsiao , et al. July 14, 2 | 2009-07-14 |
Semiconductor Package Structure, Applications Thereof And Manufacturing Method Of The Same
App 20090140413 - WANG; Meng-Jen ; et al. | 2009-06-04 |
Wafer Polishing Method
App 20090117832 - Hsiao; Wei-Min | 2009-05-07 |
Sawing Method For A Semiconductor Element With A Microelectromechanical System
App 20090042367 - Hsiao; Wei-Min | 2009-02-12 |
Packaging Structure And Method Of A Mems Microphone
App 20080166000 - Hsiao; Wei-Min | 2008-07-10 |
Mems Microphone Package And Method Thereof
App 20080164545 - Hsiao; Wei-Min | 2008-07-10 |
Mems Microphone Module And Method Thereof
App 20080157238 - Hsiao; Wei-Min | 2008-07-03 |
Semiconductor Packaging Structure Having Electromagnetic Shielding Function And Method For Manufacturing The Same
App 20080087987 - Wang; Meng-Jen ; et al. | 2008-04-17 |
Method for Encasulating Sensor Chips
App 20080009102 - Yang; Kuo-Pin ; et al. | 2008-01-10 |
Semiconductor Device Package
App 20070252261 - Wang; Meng-Jen ; et al. | 2007-11-01 |
Wafer level package for image sensor components and fabricating method thereof
App 20070187711 - Hsiao; Wei-Min ; et al. | 2007-08-16 |
Package structure and fabricating method thereof
App 20070158828 - Hsiao; Wei-Min ; et al. | 2007-07-12 |
Package structure of semiconductor and wafer-level formation thereof
Grant 7,238,590 - Yang , et al. July 3, 2 | 2007-07-03 |
Method for forming wafer-level heat spreader structure and package structure thereof
App 20060278974 - Hsiao; Wei-Min ; et al. | 2006-12-14 |
Method for packaging an image sensor die and a package thereof
App 20060255253 - Hsiao; Wei-Min ; et al. | 2006-11-16 |
Package Structure of Semiconductor and Wafer-level Formation Thereof
App 20060216859 - Yang; Kuo-Pin ; et al. | 2006-09-28 |
Package of image sensor device and formation thereof
App 20060211173 - Hsiao; Wei-Min ; et al. | 2006-09-21 |
Method of forming an encapsulation layer on a back side of a wafer
App 20060192284 - Tsai; Yu-Pen ; et al. | 2006-08-31 |
Method of forming an encapsulation layer on a back side of a wafer
App 20050067720 - Tsai, Yu-Pen ; et al. | 2005-03-31 |
Package of a chip with beveled edges
Grant 6,700,178 - Chen , et al. March 2, 2 | 2004-03-02 |
Package of a chip with beveled edges
App 20020125557 - Chen, Jian-Cheng ; et al. | 2002-09-12 |
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