Hsiao; Wei-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsiao; Wei-Chen.The latest application filed is for "forming low-resistance capping layer over metal gate electrode".
- Hsiao; Wei-Chen - Taipei City TW
- Hsiao; Wei-Chen - Taipei TW
| Patent | Date |
|---|---|
| Forming Low-Resistance Capping Layer Over Metal Gate Electrode App 20220285514 - Chen; Chia-Wei ; et al. | 2022-09-08 |
| Advanced polishing system Grant 10,160,088 - Chung , et al. Dec | 2018-12-25 |
| Advanced Polishing System App 20180043495 - Chung; Che-Liang ; et al. | 2018-02-15 |
| Advanced polishing system Grant 9,802,292 - Chung , et al. October 31, 2 | 2017-10-31 |
| Advanced Polishing System App 20170239777 - Chung; Che-Liang ; et al. | 2017-08-24 |
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