Hsiao; Sung-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsiao; Sung-Yi.The latest application filed is for "white light-emitting diode package structure for simplifying package process and method for making the same".

Company Profile

0.6.17

Hsiao; Sung-Yi - Miaoli County N/A TW
Hsiao; Sung-Yi - Gongguan Shiang TW
HSIAO; SUNG-YI - MIAOLI COUNTY 36344 TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach Grant 8,555,492 - Wang , et al. October 15, 2	2013-10-15
Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same Grant 8,263,876 - Wang , et al. September 11, 2	2012-09-11
Led Package Structure With A Deposited-type Phosphor Layer And Method For Making The Same App 20120119231 - WANG; BILY ; et al.	2012-05-17
White Light-emitting Diode Package Structure For Simplifying Package Process And Method For Making The Same App 20120122254 - WANG; BILY ; et al.	2012-05-17
Led Package Structure App 20120106171 - WANG; BILY ; et al.	2012-05-03
Conductive Substrate Structure With Conductive Channels Formed By Using A Two-sided Cut Approach And A Method For Manufacturing The Same App 20120096710 - WANG; BILY ; et al.	2012-04-26
Led Package Structure And Method Of Making The Same App 20120037937 - WANG; BILY ; et al.	2012-02-16
Wafer Level Led Package Structure For Increase Light-emitting Efficiency And Method For Making The Same App 20120009699 - WANG; BILY ; et al.	2012-01-12
Wafer Level Diode Package Structure App 20110304020 - WANG; BILY ; et al.	2011-12-15
Wafer level vertical diode package structure and method for making the same Grant 8,053,885 - Wang , et al. November 8, 2	2011-11-08
LED base Grant D645,421 - Wang , et al. September 20, 2	2011-09-20
Led Package Structure And Method Of Manufacturing The Same App 20110215357 - WANG; BILY ; et al.	2011-09-08
Conductive Substrate Structure With Conductive Channels Formed By Using A Two-sided Cut Approach And A Method For Manufacturing The Same App 20110155436 - WANG; BILY ; et al.	2011-06-30
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same App 20110147774 - WANG; BILY ; et al.	2011-06-23
Wafer level LED package structure and method for making the same Grant 7,923,747 - Wang , et al. April 12, 2	2011-04-12
White light-emitting diode package structure for simplifying package process and method for making the same App 20100264435 - Wang; Bily ; et al.	2010-10-21
Wafer level vertical diode package structure and method for making the same App 20100176502 - Wang; Bily ; et al.	2010-07-15
Wafer level led package structure for increasing light-emitting efficiency and method for making the same App 20100127292 - Wang; Bily ; et al.	2010-05-27
Wafer Level Led Package Structure For Increasing Conductive Area And Heat-dissipating Area And Method For Making The Same App 20100032706 - Wang; Bily ; et al.	2010-02-11
Semiconductor Chip Package Structure For Achieving Face-down Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same App 20090283881 - WANG; BILY ; et al.	2009-11-19
Semiconductor Chip Package Structure Without Substrates For Achieving Face-up Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same App 20090278159 - WANG; Bily ; et al.	2009-11-12
Semiconductor Chip Package Structure For Achieving Face-up Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same App 20090230538 - WANG; BILY ; et al.	2009-09-17

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