HSIAO; Shen-Li
Patent Applications and Registrations
Patent applications and USPTO patent grants for HSIAO; Shen-Li.The latest application filed is for "method for manufacturing resistor".
- HSIAO; Shen-Li - KAOHSIUNG CITY TW
- Hsiao; Shen-Li - Kaohsiung TW
- Hsiao; Shen-Li - Hsinchu County TW
- Hsiao; Shen-Li - Hsinchu County 303 TW
- Hsiao; Shen-Li - Hukou Township TW
| Patent | Date |
|---|---|
| Ignition Resistor And Method For Manufacturing The Same App 20220223326 - HSIAO; Shen-Li ; et al. | 2022-07-14 |
| Fuse Resistor And Method For Manufacturing The Same App 20220223363 - HSIAO; Shen-Li ; et al. | 2022-07-14 |
| Method For Manufacturing Resistor App 20220223325 - HSIAO; Shen-Li ; et al. | 2022-07-14 |
| Method for manufacturing shunt resistor Grant 10,839,991 - Hsiao , et al. November 17, 2 | 2020-11-17 |
| Method for manufacturing shunt resistor Grant 10,818,418 - Hsiao , et al. October 27, 2 | 2020-10-27 |
| Method For Manufacturing Shunt Resistor App 20190295748 - HSIAO; Shen-Li ; et al. | 2019-09-26 |
| Method For Manufacturing Shunt Resistor App 20190287701 - HSIAO; Shen-Li ; et al. | 2019-09-19 |
| Resistor component Grant 9,373,430 - Wei , et al. June 21, 2 | 2016-06-21 |
| Method of electroplating and depositing metal Grant 9,204,555 - Wei , et al. December 1, 2 | 2015-12-01 |
| Method for forming package substrate Grant 8,841,172 - Wei , et al. September 23, 2 | 2014-09-23 |
| Resistor Component App 20140167911 - Wei; Shih-Long ; et al. | 2014-06-19 |
| Method of Forming Substrate App 20140170848 - Wei; Shih-Long ; et al. | 2014-06-19 |
| Method of Fabricating a Light Emitting Diode Packaging Structure App 20140027051 - Wei; Shih-Long ; et al. | 2014-01-30 |
| Method of Electroplating and Depositing Metal App 20140001051 - Wei; Shih-Long ; et al. | 2014-01-02 |
| Method For Fabricating Conductive Structures of Substrate App 20130313122 - Wei; Shih-Long ; et al. | 2013-11-28 |
| Method of manufacturing a metallized ceramic substrate Grant 8,591,756 - Wei , et al. November 26, 2 | 2013-11-26 |
| Method for manufacturing alloy resistor Grant 8,590,140 - Wei , et al. November 26, 2 | 2013-11-26 |
| Method for Selective Metallization on a Ceramic Substrate App 20130098867 - Wei; Shih-Long ; et al. | 2013-04-25 |
| Method of Fabricating a Substrate Having Conductive Through Holes App 20130089982 - WEI; Shih-Long ; et al. | 2013-04-11 |
| Light Emitting Diode Packaging Structure and Method of Fabricating the Same App 20130082292 - Wei; Shih-Long ; et al. | 2013-04-04 |
| Method of Manufacturing a Metallized Ceramic Substrate App 20130048602 - Wei; Shih-Long ; et al. | 2013-02-28 |
| Method for Forming Package Substrate App 20120317806 - Wei; Shih-Long ; et al. | 2012-12-20 |
| Package Substrate and Method for Forming the Same App 20120211792 - Wei; Shih-Long ; et al. | 2012-08-23 |
| Method for Manufacturing Alloy Resistor App 20120000066 - Wei; Shih-Long ; et al. | 2012-01-05 |
| Light-Emitting Diode Packaging Structure and Substrate Therefor App 20120001212 - Wei; Shih-Long ; et al. | 2012-01-05 |
| Method of making a current sensing chip resistor Grant 7,640,652 - Hsiao , et al. January 5, 2 | 2010-01-05 |
| Method of making a current sensing chip resistor App 20080194057 - Hsiao; Shen-Li ; et al. | 2008-08-14 |
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