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name:-0.025397062301636
name:-0.018027067184448
name:-0.014868974685669
Hsiao; Min-Chien Patent Filings

Hsiao; Min-Chien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsiao; Min-Chien.The latest application filed is for "die stack structure, semiconductor structure and method of fabricating the same".

Company Profile
14.15.19
  • Hsiao; Min-Chien - Taichung City TW
  • Hsiao; Min-Chien - Taichung TW
  • Hsiao; Min-Chien - Hsin-Chu TW
  • Hsiao; Min-Chien - Hsinchu N/A TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Die Stack Structure, Semiconductor Structure And Method Of Fabricating The Same
App 20220181301 - Chen; Ming-Fa ;   et al.
2022-06-09
Semiconductor structure and method of fabricating the same
Grant 11,264,362 - Chen , et al. March 1, 2
2022-03-01
Package structure, electronic device and method of fabricating package structure
Grant 11,245,176 - Hsiao , et al. February 8, 2
2022-02-08
Package structure and manufacturing method thereof
Grant 11,244,896 - Hsiao , et al. February 8, 2
2022-02-08
Semiconductor Structure And Method Of Fabricating The Same
App 20210375826 - Chen; Ming-Fa ;   et al.
2021-12-02
Semiconductor structure and manufacturing method thereof
Grant 11,177,355 - Yu , et al. November 16, 2
2021-11-16
Semiconductor structure and method manufacturing the same
Grant 11,164,848 - Chen , et al. November 2, 2
2021-11-02
Chip Package With Antenna Element
App 20210265289 - CHIANG; Yung-Ping ;   et al.
2021-08-26
Chip package with antenna element
Grant 11,004,809 - Chiang , et al. May 11, 2
2021-05-11
Package structure and method of fabricating the same
Grant 10,937,719 - Chiang , et al. March 2, 2
2021-03-02
Semiconductor Structure And Method Manufacturing The Same
App 20200402960 - Chen; Ming-Fa ;   et al.
2020-12-24
Package Structure And Manufacturing Method Thereof
App 20200243441 - Hsiao; Min-Chien ;   et al.
2020-07-30
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20200153083 - Hsiao; Min-Chien ;   et al.
2020-05-14
Package structure, electronic device and method of fabricating package structure
Grant 10,535,913 - Hsiao , et al. Ja
2020-01-14
Chip Package With Antenna Element
App 20190279951 - CHIANG; Yung-Ping ;   et al.
2019-09-12
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20190252762 - Hsiao; Min-Chien ;   et al.
2019-08-15
Semiconductor Structure And Manufacturing Method Thereof
App 20190237553 - YU; CHEN-HUA ;   et al.
2019-08-01
Structure and formation method of chip package with antenna element
Grant 10,312,203 - Chiang , et al.
2019-06-04
Package structure, electronic device and method of fabricating package structure
Grant 10,276,920 - Hsiao , et al.
2019-04-30
Semiconductor structure and manufacturing method thereof
Grant 10,269,904 - Yu , et al.
2019-04-23
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20190097304 - Hsiao; Min-Chien ;   et al.
2019-03-28
Package Structure And Method Of Fabricating The Same
App 20180269139 - Chiang; Yung-Ping ;   et al.
2018-09-20
Structure And Formation Method Of Chip Package With Antenna Element
App 20180166405 - CHIANG; Yung-Ping ;   et al.
2018-06-14
3D package with through substrate vias
Grant 9,530,759 - Yu , et al. December 27, 2
2016-12-27
3D Package With Through Substrate Vias
App 20160218090 - Yu; Chen-Hua ;   et al.
2016-07-28
Semiconductor Structure And Manufacturing Method Thereof
App 20160126324 - YU; CHEN-HUA ;   et al.
2016-05-05
3D package with through substrate vias
Grant 9,305,877 - Yu , et al. April 5, 2
2016-04-05
Composite substrate for counter electrode of dye-sensitized solar cell
Grant 9,202,635 - Ma , et al. December 1, 2
2015-12-01
Method for fabrication of functionalized graphene reinforced composite conducting plate
App 20110315934 - Ma; Chen-Chi M. ;   et al.
2011-12-29
Fabrication of polymer grafted carbon nanotubes/polypropylene composite bipolar plates for fuel cell
App 20100283174 - Ma; Chen-Chi Martin ;   et al.
2010-11-11
Composite substrate for counter electrode of dye-sensitized solar cell
App 20100154871 - Ma; Chen-Chi Martin ;   et al.
2010-06-24
Fabrication of carbon nanotubes reinforced semi-crystalline polymer composite bipolar plates for fuel cell
App 20100127428 - Ma; Chen-Chi M. ;   et al.
2010-05-27
Fabrication of metal meshes/carbon nanotubes/polymer composite bipolar plates for fuel cell
App 20100127424 - Ma; Chen-Chi Martin ;   et al.
2010-05-27

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