Hsiao; Huang-Ting
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsiao; Huang-Ting.The latest application filed is for "semiconductor structure and method of manufacturing the same".
- Hsiao; Huang-Ting - Taoyuan County TW
- Hsiao; Huang-Ting - Tao-Yuan Hsien TW
| Patent | Date |
|---|---|
| Semiconductor structure having a conductive bump with a plurality of bump segments Grant 11,018,099 - Tsao , et al. May 25, 2 | 2021-05-25 |
| Semiconductor Structure And Method Of Manufacturing The Same App 20190096832 - TSAO; PEI-HAW ; et al. | 2019-03-28 |
| Edge crack detection system Grant 9,880,220 - Hsiao , et al. January 30, 2 | 2018-01-30 |
| Edge Crack Detection System App 20160356846 - HSIAO; HUANG-TING ; et al. | 2016-12-08 |
| Edge crack detection system Grant 9,454,684 - Hsiao , et al. September 27, 2 | 2016-09-27 |
| Semiconductor Structure And Method Of Manufacturing The Same App 20160148891 - TSAO; PEI-HAW ; et al. | 2016-05-26 |
| Edge Crack Detection System App 20150347793 - HSIAO; HUANG-TING ; et al. | 2015-12-03 |
| Wafer Packing App 20070068846 - Hsiao; Huang-Ting | 2007-03-29 |
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