Hsiao; Hsien-Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hsiao; Hsien-Lung.The latest application filed is for "method for fabricating electronic package".
- Hsiao; Hsien-Lung - Taichung TW
- Hsiao; Hsien-Lung - Taichung City TW
| Patent | Date |
|---|---|
| Carrier structure and package structure Grant 11,239,125 - Hsiao , et al. February 1, 2 | 2022-02-01 |
| Method For Fabricating Electronic Package App 20210143021 - Chang; Shu-Chi ; et al. | 2021-05-13 |
| Electronic package and method for fabricating the same Grant 10,903,088 - Chang , et al. January 26, 2 | 2021-01-26 |
| Carrier Structure And Package Structure App 20200035573 - Hsiao; Hsien-Lung ; et al. | 2020-01-30 |
| Electronic Package And Method For Fabricating The Same App 20180286701 - Chang; Shu-Chi ; et al. | 2018-10-04 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 