| Patent | Date |
|---|
Semiconductor Packages Having Conductive Pillars With Inclined Surfaces
App 20220310543 - Chu; Chiang-Jui ; et al. | 2022-09-29 |
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same
App 20220285295 - CHIANG; Wei-Han ; et al. | 2022-09-08 |
Package Structures and Methods for Forming the Same
App 20220278031 - Hsiao; Ching-Wen ; et al. | 2022-09-01 |
Bump Integration with Redistribution Layer
App 20220246565 - Yang; Ting-Li ; et al. | 2022-08-04 |
Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same
Grant 11,398,444 - Chu , et al. July 26, 2 | 2022-07-26 |
Bonding structures in semiconductor packaged device and method of forming same
Grant 11,393,771 - Liu , et al. July 19, 2 | 2022-07-19 |
Chip Structure With Conductive Via Structure And Method For Forming The Same
App 20220216143 - YANG; Ting-Li ; et al. | 2022-07-07 |
Inductor, Semiconductor Device Including The Same, And Manufacturing Method Thereof
App 20220216295 - Kuo; Chien-Hsien ; et al. | 2022-07-07 |
Organic interposer including a dual-layer inductor structure and methods of forming the same
Grant 11,348,884 - Chiang , et al. May 31, 2 | 2022-05-31 |
Package structures and methods for forming the same
Grant 11,342,253 - Hsiao , et al. May 24, 2 | 2022-05-24 |
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same
App 20220157744 - CHIANG; Wei-Han ; et al. | 2022-05-19 |
Semiconductor Device with Discrete Blocks
App 20220122944 - Hsiao; Ching-Wen ; et al. | 2022-04-21 |
A Novel Cd16+ Natural Killer Cell And A Method Of Culturing Cd16+ Natural Killer Cell
App 20220073878 - Cheng; Zih-Fei ; et al. | 2022-03-10 |
Package structure and method of fabricating the same
Grant 11,244,919 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Semiconductor device with discrete blocks
Grant 11,217,562 - Hsiao , et al. January 4, 2 | 2022-01-04 |
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375672 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Conductive structures and redistribution circuit structures
Grant 11,152,273 - Tu , et al. October 19, 2 | 2021-10-19 |
Fan-out interconnect structure and method for forming same
Grant 11,133,274 - Yu , et al. September 28, 2 | 2021-09-28 |
Wafer level embedded heat spreader
Grant 11,101,192 - Chang , et al. August 24, 2 | 2021-08-24 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20210217672 - Chen; Chih-Hua ; et al. | 2021-07-15 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,978,433 - Hsiao , et al. April 13, 2 | 2021-04-13 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,964,610 - Chen , et al. March 30, 2 | 2021-03-30 |
Electrical Devices, Semiconductor Packages And Methods Of Forming The Same
App 20210066226 - Chu; Chiang-Jui ; et al. | 2021-03-04 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,879,228 - Chen , et al. December 29, 2 | 2020-12-29 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20200328169 - Yu; Chen-Hua ; et al. | 2020-10-15 |
Biological complexes and methods for using same
Grant 10,744,207 - Twite , et al. A | 2020-08-18 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20200251463 - Kind Code | 2020-08-06 |
Conductive Structures And Redistribution Circuit Structures
App 20200243410 - Tu; Shang-Yun ; et al. | 2020-07-30 |
Fan-out interconnect structure and method for forming same
Grant 10,700,025 - Yu , et al. | 2020-06-30 |
Stacked fan-out package structure
Grant 10,692,789 - Liu , et al. | 2020-06-23 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,629,580 - Chen , et al. | 2020-04-21 |
Redistribution circuit structures and methods of forming the same
Grant 10,629,509 - Tu , et al. | 2020-04-21 |
Semiconductor Device with Discrete Blocks
App 20200118978 - Hsiao; Ching-Wen ; et al. | 2020-04-16 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20200105728 - Hsiao; Ching-Wen ; et al. | 2020-04-02 |
Bonding Structures In Semiconductor Packaged Device And Method Of Forming Same
App 20200105682 - Liu; Haochun ; et al. | 2020-04-02 |
Alignment Mark Design for Packages
App 20200091086 - Huang; Li-Hsien ; et al. | 2020-03-19 |
Package Structures and Methods for Forming the Same
App 20200083152 - Hsiao; Ching-Wen ; et al. | 2020-03-12 |
Alignment mark design for packages
Grant 10,522,473 - Huang , et al. Dec | 2019-12-31 |
Package on-package (PoP) device with integrated passive device in a via
Grant 10,515,938 - Hsiao , et al. Dec | 2019-12-24 |
Semiconductor device with discrete blocks
Grant 10,510,727 - Hsiao , et al. Dec | 2019-12-17 |
Package structures and methods for forming the same
Grant 10,510,644 - Hsiao , et al. Dec | 2019-12-17 |
Package Structure And Method Of Fabricating The Same
App 20190371754 - Hsiao; Ching-Wen ; et al. | 2019-12-05 |
Fan-out package structure and method for forming the same
Grant 10483211 - | 2019-11-19 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20190341319 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20190341379 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Semiconductor package assembly and method for forming the same
Grant 10,424,563 - Lin , et al. Sept | 2019-09-24 |
Semiconductor Package Structure Having An Antenna Pattern Electrically Coupled To A First Redistribution Layer (rdl)
App 20190252351 - Lin; Tzu-Hung ; et al. | 2019-08-15 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,361,181 - Chen , et al. | 2019-07-23 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,354,931 - Chen , et al. July 16, 2 | 2019-07-16 |
Wafer Level Embedded Heat Spreader
App 20190148264 - Chang; Wei Sen ; et al. | 2019-05-16 |
Redistribution Circuit Structures And Methods Of Forming The Same
App 20190131200 - Tu; Shang-Yun ; et al. | 2019-05-02 |
Package structure and method of fabricating the same
Grant 10,276,525 - Hsiao , et al. | 2019-04-30 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20190123029 - Hsiao; Ching-Wen ; et al. | 2019-04-25 |
Alignment mark design for packages
Grant 10,269,723 - Huang , et al. | 2019-04-23 |
Semiconductor package structure and method for forming the same
Grant 10256210 - | 2019-04-09 |
Semiconductor package assembly with embedded IPD
Grant 10,217,724 - Lin , et al. Feb | 2019-02-26 |
Wafer level embedded heat spreader
Grant 10,177,073 - Chang , et al. J | 2019-01-08 |
Semiconductor package assembly
Grant 10,177,125 - Lin , et al. J | 2019-01-08 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,163,873 - Hsiao , et al. Dec | 2018-12-25 |
Warpage control of semiconductor die package
Grant 10,134,706 - Pan , et al. November 20, 2 | 2018-11-20 |
Stacked Fan-out Package Structure
App 20180323127 - Liu; Nai-Wei ; et al. | 2018-11-08 |
Semiconductor Device with Discrete Blocks
App 20180308824 - Hsiao; Ching-Wen ; et al. | 2018-10-25 |
Semiconductor chip package assembly with improved heat dissipation performance
Grant 10,079,192 - Hsiao , et al. September 18, 2 | 2018-09-18 |
Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same
Grant 10,032,756 - Lin , et al. July 24, 2 | 2018-07-24 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20180197846 - Chen; Chih-Hua ; et al. | 2018-07-12 |
Semiconductor device with discrete blocks
Grant 10,008,479 - Hsiao , et al. June 26, 2 | 2018-06-26 |
Semiconductor package assembly
Grant 9,997,498 - Lin , et al. June 12, 2 | 2018-06-12 |
Package Structure And Method Of Fabricating The Same
App 20180151524 - Hsiao; Ching-Wen ; et al. | 2018-05-31 |
Biological Complexes And Methods For Using Same
App 20180133341 - TWITE; Amy A. ; et al. | 2018-05-17 |
Fan-out package structure having embedded package substrate
Grant 9,941,260 - Lin , et al. April 10, 2 | 2018-04-10 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,911,725 - Chen , et al. March 6, 2 | 2018-03-06 |
Cooling channels in 3DIC stacks
Grant 9,859,252 - Ching , et al. January 2, 2 | 2018-01-02 |
Semiconductor Package Structure And Method For Forming The Same
App 20170373038 - LIN; Tzu-Hung ; et al. | 2017-12-28 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20170372976 - Chen; Chih-Hua ; et al. | 2017-12-28 |
Methods for forming package-on-package structures having buffer dams
Grant 9,837,289 - Hu , et al. December 5, 2 | 2017-12-05 |
Warpage Control of Semiconductor Die Package
App 20170345788 - Pan; Kuo Lung ; et al. | 2017-11-30 |
Warpage reduction and adhesion improvement of semiconductor die package
Grant 9,799,620 - Huang , et al. October 24, 2 | 2017-10-24 |
Wafer Level Embedded Heat Spreader
App 20170301608 - Chang; Wei Sen ; et al. | 2017-10-19 |
Semiconductor package structure and method for forming the same
Grant 9,786,632 - Lin , et al. October 10, 2 | 2017-10-10 |
Alignment Mark Design for Packages
App 20170287845 - Huang; Li-Hsien ; et al. | 2017-10-05 |
Semiconductor Package Assembly
App 20170287877 - LIN; Tzu-Hung ; et al. | 2017-10-05 |
Semiconductor Package Assembly
App 20170278832 - LIN; Tzu-Hung ; et al. | 2017-09-28 |
Package Structures and Methods for Forming the Same
App 20170278777 - Hsiao; Ching-Wen ; et al. | 2017-09-28 |
Warpage control of semiconductor die package
Grant 9,773,749 - Pan , et al. September 26, 2 | 2017-09-26 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,761,503 - Chen , et al. September 12, 2 | 2017-09-12 |
Alignment Mark Design for Packages
App 20170250139 - Huang; Li-Hsien ; et al. | 2017-08-31 |
Apparatus and method for a component package
Grant 9,748,216 - Chen , et al. August 29, 2 | 2017-08-29 |
Fan-out Package Structure And Method For Forming The Same
App 20170243826 - LIN; Tzu-Hung ; et al. | 2017-08-24 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20170236813 - Chen; Chih-Hua ; et al. | 2017-08-17 |
Wafer level embedded heat spreader
Grant 9,735,087 - Chang , et al. August 15, 2 | 2017-08-15 |
Package-on-Package (PoP) Device with Integrated Passive Device in a Via
App 20170207207 - Hsiao; Ching-Wen ; et al. | 2017-07-20 |
Semiconductor package assembly
Grant 9,711,488 - Lin , et al. July 18, 2 | 2017-07-18 |
Semiconductor package assembly
Grant 9,704,836 - Lin , et al. July 11, 2 | 2017-07-11 |
Package structures and methods for forming the same
Grant 9,679,836 - Hsiao , et al. June 13, 2 | 2017-06-13 |
Alignment mark design for packages
Grant 9,666,522 - Huang , et al. May 30, 2 | 2017-05-30 |
Foldable Statue Bag
App 20170137181 - Liao; Min Chun ; et al. | 2017-05-18 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,646,894 - Chen , et al. May 9, 2 | 2017-05-09 |
Semiconductor Device with Discrete Blocks
App 20170125386 - Hsiao; Ching-Wen ; et al. | 2017-05-04 |
Stacked Fan-out Package Structure
App 20170098629 - LIU; Nai-Wei ; et al. | 2017-04-06 |
Fan-out Wafer Level Package Structure
App 20170098589 - LIU; Nai-Wei ; et al. | 2017-04-06 |
Semiconductor Package Structure And Method For Forming The Same
App 20170098628 - LIU; Nai-Wei ; et al. | 2017-04-06 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 9,613,917 - Hsiao , et al. April 4, 2 | 2017-04-04 |
Copper bump joint structures with improved crack resistance
Grant 9,607,936 - Hsiao , et al. March 28, 2 | 2017-03-28 |
Fan-out Package Structure Having Embedded Package Substrate
App 20170077073 - LIN; Tzu-Hung ; et al. | 2017-03-16 |
Warpage Control of Semiconductor Die Package
App 20170069594 - Pan; Kuo Lung ; et al. | 2017-03-09 |
Structure And Layout Of Ball Grid Array Packages
App 20170053884 - Lin; Tzu-Hung ; et al. | 2017-02-23 |
Package structures including a capacitor and methods of forming the same
Grant 9,576,821 - Lo , et al. February 21, 2 | 2017-02-21 |
Semiconductor Package Structure And Method For Forming The Same
App 20170033079 - LIN; Tzu-Hung ; et al. | 2017-02-02 |
Semiconductor device with discrete blocks
Grant 9,543,278 - Hsiao , et al. January 10, 2 | 2017-01-10 |
Warpage control of semiconductor die package
Grant 9,508,674 - Pan , et al. November 29, 2 | 2016-11-29 |
Semiconductor Package Assembly And Method For Forming The Same
App 20160343695 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
Semiconductor Package Assembly And Method For Forming The Same
App 20160343685 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
Semiconductor Package Assembly And Method For Forming The Same
App 20160343694 - LIN; Tzu-Hung ; et al. | 2016-11-24 |
Fan-out Package Structure Including Antenna
App 20160329299 - LIN; Tzu-Hung ; et al. | 2016-11-10 |
Semiconductor Chip Package Assembly With Improved Heat Dissipation Performance
App 20160329262 - Hsiao; Ching-Wen ; et al. | 2016-11-10 |
Semiconductor Package Assembly With Embedded Ipd
App 20160293581 - LIN; Tzu-Hung ; et al. | 2016-10-06 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20160284654 - Yu; Chen-Hua ; et al. | 2016-09-29 |
Cooling Channels in 3DIC Stacks
App 20160276314 - Ching; Kai-Ming ; et al. | 2016-09-22 |
Semiconductor Package Assembly
App 20160276324 - LIN; Tzu-Hung ; et al. | 2016-09-22 |
Connecting function chips to a package to form package-on-package
Grant 9,449,941 - Tsai , et al. September 20, 2 | 2016-09-20 |
Semiconductor Package Assembly
App 20160268234 - LIN; Tzu-Hung ; et al. | 2016-09-15 |
Packaged semiconductor devices and packaging methods
Grant 9,418,969 - Hu , et al. August 16, 2 | 2016-08-16 |
Methods For Forming Package-On-Package Structures Having Buffer Dams
App 20160233113 - Hu; Shou-Cheng ; et al. | 2016-08-11 |
Fan-out interconnect structure and method for forming same
Grant 9,368,460 - Yu , et al. June 14, 2 | 2016-06-14 |
Cooling channels in 3DIC stacks
Grant 9,355,933 - Ching , et al. May 31, 2 | 2016-05-31 |
Front side copper post joint structure for temporary bond in TSV application
Grant 9,349,699 - Huang , et al. May 24, 2 | 2016-05-24 |
Methods for forming package-on-package structures having buffer dams
Grant 9,330,947 - Hu , et al. May 3, 2 | 2016-05-03 |
Light emitting diode
Grant 9,324,910 - Wu , et al. April 26, 2 | 2016-04-26 |
Semiconductor Device with Discrete Blocks
App 20160111398 - Hsiao; Ching-Wen ; et al. | 2016-04-21 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 9,293,449 - Hu , et al. March 22, 2 | 2016-03-22 |
Semiconductor Package Assembly
App 20160079205 - LIN; Tzu-Hung ; et al. | 2016-03-17 |
PoP structures including through-assembly via modules
Grant 9,258,922 - Chen , et al. February 9, 2 | 2016-02-09 |
Through-assembly via modules and methods for forming the same
Grant 9,257,332 - Chen , et al. February 9, 2 | 2016-02-09 |
Integrated inductor
Grant 9,219,106 - Lin , et al. December 22, 2 | 2015-12-22 |
Alignment Mark Design For Packages
App 20150348904 - Huang; Li-Hsien ; et al. | 2015-12-03 |
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package
App 20150303158 - Huang; Yu-Chih ; et al. | 2015-10-22 |
Semiconductor device with discrete blocks
Grant 9,165,887 - Hsiao , et al. October 20, 2 | 2015-10-20 |
Portable optical fiber end face polisher
Grant 9,138,853 - Wang , et al. September 22, 2 | 2015-09-22 |
Apparatus for lead free solder interconnections for integrated circuits
Grant 9,142,500 - Chuang , et al. September 22, 2 | 2015-09-22 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20150262898 - Chen; Chih-Hua ; et al. | 2015-09-17 |
Packaged Semiconductor Devices and Packaging Methods
App 20150243636 - Hu; Yen-Chang ; et al. | 2015-08-27 |
Warpage reduction and adhesion improvement of semiconductor die package
Grant 9,087,832 - Huang , et al. July 21, 2 | 2015-07-21 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,070,644 - Chen , et al. June 30, 2 | 2015-06-30 |
Peripheral electrical connection of package on package
Grant 9,070,667 - Hsiao , et al. June 30, 2 | 2015-06-30 |
Packaging and function tests for package-on-package and system-in-package structures
Grant 9,040,350 - Liu , et al. May 26, 2 | 2015-05-26 |
Packaged semiconductor devices and packaging methods
Grant 9,035,461 - Hu , et al. May 19, 2 | 2015-05-19 |
Fiber network events measurement apparatus
Grant 9,008,506 - Hsiao , et al. April 14, 2 | 2015-04-14 |
Through-Assembly Via Modules and Methods for Forming the Same
App 20150093881 - Chen; Chih-Hua ; et al. | 2015-04-02 |
Light Emitting Diode And Method Of Fabrication Thereof
App 20150083998 - Wu; Hsin-Hsien ; et al. | 2015-03-26 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20150072476 - Hu; Yen-Chang ; et al. | 2015-03-12 |
Apparatus and Method for a Component Package
App 20150069595 - Chen; Chih-Hua ; et al. | 2015-03-12 |
Portable Optical Fiber End Face Polisher
App 20150038063 - WANG; CHUN-KUO ; et al. | 2015-02-05 |
Through-assembly via modules and methods for forming the same
Grant 8,928,114 - Chen , et al. January 6, 2 | 2015-01-06 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,921,222 - Kuo , et al. December 30, 2 | 2014-12-30 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 08922005 - | 2014-12-30 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 8,922,005 - Hu , et al. December 30, 2 | 2014-12-30 |
Light emitting diode and method of fabrication thereof
Grant 8,906,712 - Wu , et al. December 9, 2 | 2014-12-09 |
Apparatus and method for a component package
Grant 8,889,484 - Chen , et al. November 18, 2 | 2014-11-18 |
Methods For Forming Package-on-package Structures Having Buffer Dams
App 20140335662 - Hu; Yen-Chang ; et al. | 2014-11-13 |
Thin wafer handling structure and method
Grant 8,871,609 - Yu , et al. October 28, 2 | 2014-10-28 |
Fan-out package comprising bulk metal
Grant 8,866,285 - Hu , et al. October 21, 2 | 2014-10-21 |
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
App 20140302669 - Kuo; Tin-Hao ; et al. | 2014-10-09 |
Remotely controlled fiber testing method
Grant 8,855,486 - Lin , et al. October 7, 2 | 2014-10-07 |
Robust joint structure for flip-chip bonding
Grant 8,847,387 - Hsiao , et al. September 30, 2 | 2014-09-30 |
Packaging Mechanisms For Dies With Different Sizes Of Connectors
App 20140264769 - Chen; Chih-Hua ; et al. | 2014-09-18 |
Packaging Mechanisms For Dies With Different Sizes Of Connectors
App 20140264337 - Chen; Chih-Hua ; et al. | 2014-09-18 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20140264930 - Yu; Chen-Hua ; et al. | 2014-09-18 |
Detecting device for detecting insertion loss and return loss of individual events in an optical fiber network
Grant 8,837,937 - Hsiao , et al. September 16, 2 | 2014-09-16 |
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package
App 20140252647 - Huang; Yu-Chih ; et al. | 2014-09-11 |
Packaging and Function Tests for Package-on-Package and System-in-Package Structures
App 20140248722 - Liu; Hao-Juin ; et al. | 2014-09-04 |
Peripheral Electrical Connection of Package on Package
App 20140239507 - Hsiao; Ching-Wen ; et al. | 2014-08-28 |
Package-on-Package structures having buffer dams and method for forming the same
Grant 8,816,507 - Hu , et al. August 26, 2 | 2014-08-26 |
Apparatus For Lead Free Solder Interconnections For Integrated Circuits
App 20140231994 - Chuang; Yao-Chun ; et al. | 2014-08-21 |
Front Side Copper Post Joint Structure for Temporary Bond in TSV Application
App 20140227831 - Huang; Hon-Lin ; et al. | 2014-08-14 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,803,319 - Kuo , et al. August 12, 2 | 2014-08-12 |
Packaged Semiconductor Devices and Packaging Methods
App 20140210099 - Hu; Yen-Chang ; et al. | 2014-07-31 |
Methods and apparatus for solder on slot connections in package on package structures
Grant 8,766,441 - Chang , et al. July 1, 2 | 2014-07-01 |
Packaging and function tests for package-on-package and system-in-package structures
Grant 8,765,497 - Liu , et al. July 1, 2 | 2014-07-01 |
Remotely Controlled Fiber Testing Method
App 20140161444 - LIN; Shih-Tien ; et al. | 2014-06-12 |
Front side copper post joint structure for temporary bond in TSV application
Grant 8,736,050 - Huang , et al. May 27, 2 | 2014-05-27 |
Warpage Control of Semiconductor Die Package
App 20140131858 - Pan; Kuo Lung ; et al. | 2014-05-15 |
Thin Wafer Handling Method
App 20140130962 - YU; Chen-Hua ; et al. | 2014-05-15 |
Package Structures Including a Capacitor and Methods of Forming the Same
App 20140127866 - Lo; Sut-I ; et al. | 2014-05-08 |
Cooling Channels in 3DIC Stacks
App 20140103540 - Ching; Kai-Ming ; et al. | 2014-04-17 |
Apparatus and Method for a Component Package
App 20140091471 - Chen; Chih-Hua ; et al. | 2014-04-03 |
Wafer Level Embedded Heat Spreader
App 20140077394 - Chang; Wei Sen ; et al. | 2014-03-20 |
Semiconductor Device with Discrete Blocks
App 20140070422 - Hsiao; Ching-Wen ; et al. | 2014-03-13 |
Fan-Out Package Comprising Bulk Metal
App 20140061937 - Hu; Yen-Chang ; et al. | 2014-03-06 |
Package structures including a capacitor and methods of forming the same
Grant 8,653,626 - Lo , et al. February 18, 2 | 2014-02-18 |
Variable Frequency Microwave Device And Method For Rectifying Wafer Warpage
App 20140042152 - HU; Yen-Chang ; et al. | 2014-02-13 |
Package-on-package Structures Having Buffer Dams And Methods For Forming The Same
App 20140027901 - Hu; Yen-Chang ; et al. | 2014-01-30 |
Package Structures Including A Capacitor And Methods Of Forming The Same
App 20140021583 - Lo; Sut-I ; et al. | 2014-01-23 |
Cooling channels in 3DIC stacks
Grant 8,624,360 - Ching , et al. January 7, 2 | 2014-01-07 |
Detecting Device for Detecting Insertion Loss and Return Loss of Individual Events in an Optical Fiber Network
App 20130322874 - Hsiao; Ching-Wen ; et al. | 2013-12-05 |
Fiber Network Events Measurement Apparatus
App 20130322871 - HSIAO; Ching-Wen ; et al. | 2013-12-05 |
Wafer-leveled chip packaging structure and method thereof
Grant 8,587,091 - Chen , et al. November 19, 2 | 2013-11-19 |
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
App 20130292827 - Kuo; Tin-Hao ; et al. | 2013-11-07 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20130270682 - Hu; Yen-Chang ; et al. | 2013-10-17 |
Package-on-Package (PoP) Device with Integrated Passive Device
App 20130256836 - Hsiao; Ching-Wen ; et al. | 2013-10-03 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,546,945 - Kuo , et al. October 1, 2 | 2013-10-01 |
Methods and Apparatus for Solder on Slot Connections in Package on Package Structures
App 20130241052 - Chang; Wei Sen ; et al. | 2013-09-19 |
PoP Structures Including Through-Assembly Via Modules
App 20130182402 - Chen; Chih-Hua ; et al. | 2013-07-18 |
Through-Assembly Via Modules and Methods for Forming the Same
App 20130181325 - Chen; Chih-Hua ; et al. | 2013-07-18 |
Package Structures and Methods for Forming the Same
App 20130119539 - Hsiao; Ching-Wen ; et al. | 2013-05-16 |
Packaging and Function Tests for Package-on-Package and System-in-Package Structures
App 20130056872 - Liu; Hao-Juin ; et al. | 2013-03-07 |
Pillar Structure Having A Non-planar Surface For Semiconductor Devices
App 20130056869 - Kuo; Tin-Hao ; et al. | 2013-03-07 |
Integrated Inductor
App 20130032923 - Lin; Yen-Liang ; et al. | 2013-02-07 |
Connecting Function Chips To A Package To Form Package-On-Package
App 20130009303 - Tsai; Pei-Chun ; et al. | 2013-01-10 |
Methods of fabricating light emitting diode devices
Grant 8,349,628 - Chen , et al. January 8, 2 | 2013-01-08 |
Pillar structure having a non-planar surface for semiconductor devices
Grant 8,318,596 - Kuo , et al. November 27, 2 | 2012-11-27 |
Light Emitting Diode And Method Of Fabrication Thereof
App 20120292629 - Wu; Hsin-Hsien ; et al. | 2012-11-22 |
Semiconductor package device
Grant 8,314,482 - Chen , et al. November 20, 2 | 2012-11-20 |
T-shaped post for semiconductor devices
Grant 8,299,616 - Chuang , et al. October 30, 2 | 2012-10-30 |
Methods for Lead Free Solder Interconnections for Integrated Circuits
App 20120270369 - Chuang; Yao-Chun ; et al. | 2012-10-25 |
Wafer-leveled Chip Packaging Structure And Method Thereof
App 20120267765 - CHEN; Shou-Lung ; et al. | 2012-10-25 |
Methods Of Fabricating Light Emitting Diode Devices
App 20120244652 - CHEN; Yung-Chang ; et al. | 2012-09-27 |
Lead free solder interconnections for integrated circuits
Grant 8,232,643 - Chuang , et al. July 31, 2 | 2012-07-31 |
Strong interconnection post geometry
Grant 8,178,970 - Shen , et al. May 15, 2 | 2012-05-15 |
Formation of TSV backside interconnects by modifying carrier wafers
Grant 8,158,489 - Huang , et al. April 17, 2 | 2012-04-17 |
Single longitudinal mode fiber laser apparatus
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Three-dimensional integrated circuit stacking-joint interface structure
Grant 8,097,953 - Tseng , et al. January 17, 2 | 2012-01-17 |
Under-Bump Metallization Structure for Semiconductor Devices
App 20110227216 - Tseng; Ming-Hung ; et al. | 2011-09-22 |
Methods and Apparatus for Robust Flip Chip Interconnections
App 20110193227 - Chuang; Yao-Chun ; et al. | 2011-08-11 |
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
App 20110193220 - Kuo; Tin-Hao ; et al. | 2011-08-11 |
T-Shaped Post for Semiconductor Devices
App 20110186986 - Chuang; Yao-Chun ; et al. | 2011-08-04 |
Copper Bump Joint Structures with Improved Crack Resistance
App 20110101526 - Hsiao; Ching-Wen ; et al. | 2011-05-05 |
Robust Joint Structure for Flip-Chip Bonding
App 20110101519 - Hsiao; Ching-Wen ; et al. | 2011-05-05 |
System, apparatus, and method for loading bits into sub-channels
Grant 7,929,564 - Lee , et al. April 19, 2 | 2011-04-19 |
Strong Interconnection Post Geometry
App 20110068465 - Shen; Wen-Wei ; et al. | 2011-03-24 |
Front Side Copper Post Joint Structure for Temporary Bond in TSV Application
App 20110049706 - Huang; Hon-Lin ; et al. | 2011-03-03 |
Semiconductor device and fabrication methods thereof
Grant 7,888,236 - Pu , et al. February 15, 2 | 2011-02-15 |
Thin Wafer Handling Structure And Method
App 20100330788 - YU; Chen-Hua ; et al. | 2010-12-30 |
Formation of TSV Backside Interconnects by Modifying Carrier Wafers
App 20100330798 - Huang; Hon-Lin ; et al. | 2010-12-30 |
Electronic device package and method of manufacturing the same
Grant 7,838,333 - Chen , et al. November 23, 2 | 2010-11-23 |
Cooling Channels in 3DIC Stacks
App 20100117201 - Ching; Kai-Ming ; et al. | 2010-05-13 |
Electronic Device Package And Method Of Manufacturing The Same
App 20100112757 - CHEN; Shou-Lung ; et al. | 2010-05-06 |
Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure
App 20100102453 - Tseng; Ming-Hong ; et al. | 2010-04-29 |
Electronic device package and method of manufacturing the same
Grant 7,632,707 - Chen , et al. December 15, 2 | 2009-12-15 |
System, Apparatus, and Method for Loading Bits into Sub-Channels
App 20090232156 - Lee; Ta-Sung ; et al. | 2009-09-17 |
Packaging structure and method of an image sensor module
Grant 7,572,676 - Leu , et al. August 11, 2 | 2009-08-11 |
Method to control the pretilt angle of liquid crystal device
Grant 7,554,639 - Hsiao , et al. June 30, 2 | 2009-06-30 |
Wafer-leveled chip packaging structure and method thereof
Grant 7,528,009 - Chen , et al. May 5, 2 | 2009-05-05 |
Semiconductor device and fabrication methods thereof
App 20080286938 - Pu; Han-Ping ; et al. | 2008-11-20 |
Packaging structure and method of an image sensor module
Grant 7,411,306 - Leu , et al. August 12, 2 | 2008-08-12 |
Method for alignment of liquid crystal molecules by using hydrogen ion beam in an amount greater than one hundred times that of non-hydrogen ions
Grant 7,405,788 - Wu , et al. July 29, 2 | 2008-07-29 |
Optical Network Remote Power Supply System For Remote Switching Unit
App 20080166133 - Hsiao; Ching-Wen | 2008-07-10 |
Optical Network Backup Channel Switching Control Device
App 20080166122 - Hsiao; Ching-Wen | 2008-07-10 |
Wafer-leveled chip packaging structure and method thereof
App 20080029870 - Chen; Shou-Lung ; et al. | 2008-02-07 |
Method to control the pretilt angle of liquid crystal device
App 20070263151 - Hsiao; Ching-Wen ; et al. | 2007-11-15 |
Wafer-leveled chip packaging structure and method thereof
Grant 7,294,920 - Chen , et al. November 13, 2 | 2007-11-13 |
Packaging structure and method of an image sensor module
App 20070195188 - Leu; Fang-Jun ; et al. | 2007-08-23 |
Wafer-leveled chip packaging structure and method thereof
App 20070197018 - Chen; Shou-Lung ; et al. | 2007-08-23 |
Method for alignment of liquid crystal molecules by using hydrogen ion beam
App 20070002270 - Wu; Bang-Hao ; et al. | 2007-01-04 |
Electronic device package and method of manufacturing the same
App 20060157864 - Chen; Shou-Lung ; et al. | 2006-07-20 |
Packaging structure and method of an image sensor module
App 20060030070 - Leu; Fang-Jun ; et al. | 2006-02-09 |
Wafer-leveled chip packaging structure and method thereof
App 20060019484 - Chen; Shou-Lung ; et al. | 2006-01-26 |
Gain controller with selectable wavelength feedback
App 20050111077 - Hsiao, Ching-Wen ; et al. | 2005-05-26 |
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