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Patent applications and USPTO patent grants for Hsiao; Chien-Wen.The latest application filed is for "apparatus and method of removing photoresist layer".
Patent | Date |
---|---|
Apparatus and method of removing photoresist layer Grant 11,090,696 - Chang , et al. August 17, 2 | 2021-08-17 |
Apparatus And Method Of Removing Photoresist Layer App 20200094298 - CHANG; Jui-Chuan ;   et al. | 2020-03-26 |
Single wafer cleaning tool with H.sub.2SO.sub.4 recycling Grant 10,510,527 - Hsiao , et al. Dec | 2019-12-17 |
Semiconductor apparatus and method of removing photoresist layer on substrate Grant 10,486,204 - Chang , et al. Nov | 2019-11-26 |
Mechanisms for wafer cleaning Grant 9,349,617 - Yu , et al. May 24, 2 | 2016-05-24 |
Semiconductor Apparatus And Method Of Removing Photoresist Layer On Substrate App 20160129484 - CHANG; Jui-Chuan ;   et al. | 2016-05-12 |
Mechanisms For Wafer Cleaning App 20150144159 - YU; Shang-Yuan ;   et al. | 2015-05-28 |
Single Wafer Cleaning Tool with H2SO4 Recycling App 20140216500 - Hsiao; Chien-Wen ;   et al. | 2014-08-07 |
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