| Patent | Date |
|---|
3D Integrated Circuit and Methods of Forming the Same
App 20220310449 - Kuang; Hsun-Chung ; et al. | 2022-09-29 |
3D Integrated Circuit and Methods of Forming the Same
App 20220208607 - Kuang; Hsun-Chung ; et al. | 2022-06-30 |
Structure and method to expose memory cells with different sizes
Grant 11,367,623 - Chen , et al. June 21, 2 | 2022-06-21 |
Techniques For Mram Mtj Top Electrode Connection
App 20220077385 - Chen; Sheng-Chau ; et al. | 2022-03-10 |
Structure Improving Reliability Of Top Electrode Contact For Resistance Switching Ram Having Cells Of Varying Height
App 20210384424 - Hsiao; Cheng-Tai ; et al. | 2021-12-09 |
MRAM MTJ top electrode connection
Grant 11,183,627 - Chen , et al. November 23, 2 | 2021-11-23 |
Structure and method to expose memory cells with different sizes
Grant 11,183,394 - Chen , et al. November 23, 2 | 2021-11-23 |
Memory device using an etch stop dielectric layer and methods for forming the same
Grant 11,152,426 - Hsiao , et al. October 19, 2 | 2021-10-19 |
Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying height
Grant 11,121,315 - Hsiao , et al. September 14, 2 | 2021-09-14 |
Memory Device Using An Etch Stop Dielectric Layer And Methods For Forming The Same
App 20210217812 - HSIAO; Cheng-Tai ; et al. | 2021-07-15 |
Structure Improving Reliability Of Top Electrode Contact For Resistance Switching Ram Having Cells Of Varying Height
App 20210210681 - Hsiao; Cheng-Tai ; et al. | 2021-07-08 |
3D Integrated Circuit and Methods of Forming the Same
App 20210151353 - Kuang; Hsun-Chung ; et al. | 2021-05-20 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20210050220 - Chen; Sheng-Chau ; et al. | 2021-02-18 |
3D Integrated Circuit and Methods of Forming the Same
App 20210013098 - Kuang; Hsun-Chung ; et al. | 2021-01-14 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20200335353 - Chen; Sheng-Chau ; et al. | 2020-10-22 |
3D integrated circuit and methods of forming the same
Grant 10,790,189 - Kuang , et al. September 29, 2 | 2020-09-29 |
Structure and method to expose memory cells with different sizes
Grant 10,727,077 - Chen , et al. | 2020-07-28 |
Techniques For Mram Mtj Top Electrode Connection
App 20200144484 - Chen; Sheng-Chau ; et al. | 2020-05-07 |
Techniques for MRAM MTJ top electrode connection
Grant 10,529,913 - Chen , et al. J | 2020-01-07 |
Techniques For Mram Mtj Top Electrode Connection
App 20200006638 - Chen; Sheng-Chau ; et al. | 2020-01-02 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20190157099 - Chen; Sheng-Chau ; et al. | 2019-05-23 |
3D Integrated Circuit and Methods of Forming the Same
App 20190035681 - Kuang; Hsun-Chung ; et al. | 2019-01-31 |
Through via structure and manufacturing method thereof
Grant 10,181,441 - Hsiao , et al. Ja | 2019-01-15 |
Structure and method to expose memory cells with different sizes
Grant 10,163,651 - Chen , et al. Dec | 2018-12-25 |
Wafer bonding process and structure
Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
3D integrated circuit and methods of forming the same
Grant 10,090,196 - Kuang , et al. October 2, 2 | 2018-10-02 |
Through Via Structure And Manufacturing Method Thereof
App 20180145021 - HSIAO; CHENG-TAI ; et al. | 2018-05-24 |
Wafer Bonding Process and Structure
App 20160358882 - Liu; Ping-Yin ; et al. | 2016-12-08 |
Wafer bonding process and structure
Grant 9,425,155 - Liu , et al. August 23, 2 | 2016-08-23 |
3D Integrated Circuit and Methods of Forming the Same
App 20160155665 - Kuang; Hsun-Chung ; et al. | 2016-06-02 |
3D integrated circuit and methods of forming the same
Grant 9,257,399 - Kuang , et al. February 9, 2 | 2016-02-09 |
Wafer Bonding Process and Structure
App 20150243611 - Liu; Ping-Yin ; et al. | 2015-08-27 |
3D Integrated Circuit and Methods of Forming the Same
App 20150108644 - Kuang; Hsun-Chung ; et al. | 2015-04-23 |
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