| Patent | Date |
|---|
Polymer Dispersion, Method For Manufacturing The Polymer Dispersion, And Method For Manufacturing Polymer Composite Film
App 20220169789 - LEE; KUAN-WEI ; et al. | 2022-06-02 |
Transparent Polyimide Mixture, Method For Manufacturing The Transparent Polyimide Mixture, And Method For Manufacturing Transparent Polyimide Film
App 20220169851 - LEE; KUAN-WEI ; et al. | 2022-06-02 |
Thick Polyimide Film And Method For Manufacturing Same
App 20220152912 - HUANG; WEI-HSIN ; et al. | 2022-05-19 |
Polyimide Film And Method For Manufacturing Same
App 20220135797 - HUANG; WEI-HSIN ; et al. | 2022-05-05 |
Circuit board using low dielectric resin composition
Grant 11,261,328 - Su , et al. March 1, 2 | 2022-03-01 |
Fluorine-containing Dispersion And Method Of Manufacturing The Same, And Fluorine-containing Composite Film
App 20220033663 - LEE; KUAN-WEI ; et al. | 2022-02-03 |
Polyimide Component, Polyimide Film, And Polyimide Copper Clad Laminate
App 20220002490 - LEE; KUAN-WEI ; et al. | 2022-01-06 |
Liquid Crystal Polymer Composition, Copper Substrate, And Method For Manufacturing The Copper Substrate
App 20210363384 - LEE; KUAN-WEI ; et al. | 2021-11-25 |
Circuit Board Using Low Dielectric Resin Composition
App 20210102067 - SU; SZU-HSIANG ; et al. | 2021-04-08 |
Polyimide Film, Block Copolymer Of Polyamide Acid, And Method For Manufacturing The Block Copolymer Of Polyamide Acid
App 20210087319 - LEE; KUAN-WEI ; et al. | 2021-03-25 |
Photosensitive resin composition, and polymer film made therefrom
Grant 10,928,730 - Yen , et al. February 23, 2 | 2021-02-23 |
Polyamic Acid Composition, Polyimide Film, And Copper Clad Laminate
App 20210017336 - SU; SZU-HSIANG ; et al. | 2021-01-21 |
Low dielectric resin composition, film and circuit board using the same
Grant 10,894,882 - Su , et al. January 19, 2 | 2021-01-19 |
Inorganic shell, resin composition, and method for making inorganic shell
Grant 10,875,984 - Liang , et al. December 29, 2 | 2020-12-29 |
Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same
Grant 10,844,174 - Huang , et al. November 24, 2 | 2020-11-24 |
Modified polyimide compound, resin composition and polyimide film
Grant 10,822,522 - Ho , et al. November 3, 2 | 2020-11-03 |
Elastic Conductive Composite Fabric Capable Of Detecting And Providing Electrical Signals According To Reflections Of Limbs And Body Movements
App 20200338868 - HUANG; CHI-FEI ; et al. | 2020-10-29 |
Photosensitive Resin Composition, And Polymer Film Made Therefrom
App 20190361349 - YEN; CHEN-FENG ; et al. | 2019-11-28 |
Modified Polyimide Compound, Resin Composition And Polyimide Film
App 20190359852 - HO; MING-JAAN ; et al. | 2019-11-28 |
Modified Liquid Crystal Polymer, Polymeric Film, And Method For Manufacturing The Modified Liquid Crystal Polymer
App 20190352456 - HSIANG; SHOU-JUI ; et al. | 2019-11-21 |
Resin composition, polyimide film and method for manufacturing polyimide film
Grant 10,428,238 - Ho , et al. October 1, 2 | 2019-10-01 |
Water soluble photosensitive resin composition and film using same
Grant 10,423,069 - Yen , et al. Sept | 2019-09-24 |
Photosensitive resin composition, and film and printed circuit board using same
Grant 10,329,368 - Hsu , et al. | 2019-06-25 |
Low Dielectric Polyimide Composition, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same
App 20190085131 - HUANG; NAN-KUN ; et al. | 2019-03-21 |
Inorganic Shell, Resin Composition, And Method For Making Inorganic Shell
App 20190055378 - LIANG; KUO-SHENG ; et al. | 2019-02-21 |
Low Dielectric Resin Composition, Film And Circuit Board Using The Same
App 20180265699 - SU; SZU-HSIANG ; et al. | 2018-09-20 |
Resin Composition, Method For Making Resin Composition And Film For Circuit Board, And Circuit Board
App 20180223048 - HSU; MAO-FENG ; et al. | 2018-08-09 |
Resin Composition, Polyimide Film And Method For Manufacturing Polyimide Film
App 20180201805 - HO; MING-JAAN ; et al. | 2018-07-19 |
Photosensitive Resin Composition, Method For Making Photosensitive Resin Composition, And Method For Making Printed Circuit Board Therewith
App 20180203350 - HSU; MAO-FENG ; et al. | 2018-07-19 |
Water Soluble Photosensitive Resin Composition And Film Using Same
App 20180188649 - YEN; CHEN-FENG ; et al. | 2018-07-05 |
Resin Composition, Adhesive Film, And Circuit Board Using The Same
App 20170369747 - SU; SZU-HSIANG ; et al. | 2017-12-28 |
Polyamic Acid, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same
App 20170369653 - KAO; YU-WEN ; et al. | 2017-12-28 |
Photosensitive Resin Composition, And Film And Printed Circuit Board Using Same
App 20170362361 - HSU; MAO-FENG ; et al. | 2017-12-21 |
Circuit Board And Method For Making The Same
App 20170079136 - SU; SZU-HSIANG ; et al. | 2017-03-16 |
Polyamic acid, polyimide, and method for manufacturing graphite sheet
Grant 9,593,207 - Hsiang , et al. March 14, 2 | 2017-03-14 |
Polyamic Acid, Polyimide, And Method For Manufacturing Graphite Sheet
App 20150130098 - HSIANG; Shou-Jui ; et al. | 2015-05-14 |
Cover film
Grant 8,765,258 - Lin , et al. July 1, 2 | 2014-07-01 |
Composite double-sided copper foil substrates and flexible printed circuit board structures using the same
Grant 8,536,460 - Lin , et al. September 17, 2 | 2013-09-17 |
Composite Double-sided Copper Foil Substrates And Flexible Printed Circuit Board Structures Using The Same
App 20110114371 - Lin; Chih-Ming ; et al. | 2011-05-19 |
Cover Layer For Printed Circuit Board
App 20110086192 - Lin; Chih-Ming ; et al. | 2011-04-14 |
Cover Layer For Printed Circuit Board
App 20100330321 - Lin; Chih-Ming ; et al. | 2010-12-30 |
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