Hsia; Shaw-Tzeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hsia; Shaw-Tzeng.The latest application filed is for "image sensor, operation method thereof, and imaging device".

Company Profile

2.11.1

Hsia; Shaw-Tzeng - Jiangsu CN
Hsia; Shaw-Tzeng - Huaian CN
Hsia; Shaw-Tzeng - Taipei TW
Hsia; Shaw-Tzeng - Hsin chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image sensor, operation method thereof, and imaging device Grant 10,609,300 - Feng , et al.	2020-03-31
Image Sensor, Operation Method Thereof, And Imaging Device App 20190104247 - Feng; Xinhe ; et al.	2019-04-04
In-situ SOG etchback and deposition for IMD process Grant 5,849,640 - Hsia , et al. December 15, 1	1998-12-15
Optimized tungsten contact plug process via use of furnace annealed barrier layers Grant 5,705,442 - Yen , et al. January 6, 1	1998-01-06
Annealing of titanium - titanium nitride in contact hole Grant 5,591,672 - Lee , et al. January 7, 1	1997-01-07
Nitridation of titanium, for use with tungsten filled contact holes Grant 5,552,340 - Lee , et al. September 3, 1	1996-09-03
Two step etch back spin-on-glass process for semiconductor planarization Grant 5,461,010 - Chen , et al. October 24, 1	1995-10-24
Inter-metal-dielectric planarization process Grant 5,393,708 - Hsia , et al. February 28, 1	1995-02-28
Submicron planarization process with passivation on metal line Grant 5,366,850 - Chen , et al. November 22, 1	1994-11-22
Aluminum plug process Grant 5,356,836 - Chen , et al. October 18, 1	1994-10-18
Blanket tungsten etchback process using disposable spin-on-glass Grant 5,286,675 - Chen , et al. February 15, 1	1994-02-15
Spin-on-glass integration planarization having siloxane partial etchback and silicate processes Grant 5,250,472 - Chen , et al. October 5, 1	1993-10-05

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