Howland; William H. JR.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Howland; William H. JR..The latest application filed is for "method of measuring semiconductor wafers with an oxide enhanced probe".

Company Profile

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Howland; William H. JR. - Wexford PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of measuring semiconductor wafers with an oxide enhanced probe App 20060219658 - Howland; William H. JR.	2006-10-05
In-situ wafer and probe desorption using closed loop heating App 20060097740 - Howland; William H. JR. ; et al.	2006-05-11
Method and apparatus for determining concentration of defects and/or impurities in a semiconductor wafer App 20060066323 - Howland; William H. JR. ; et al.	2006-03-30
Method of detecting un-annealed ion implants App 20060068514 - Howland; William H. JR.	2006-03-30
Apparatus And Method For Detecting Soft Breakdown Of A Dielectric Layer Of A Semiconductor Wafer App 20050287684 - Howland, William H. JR. ; et al.	2005-12-29
Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof App 20050253618 - Howland, William H. JR. ; et al.	2005-11-17
Method and apparatus for removing and/or preventing surface contamination of a probe App 20050241175 - Howland, William H. JR. ; et al.	2005-11-03
Method and apparatus for determining the dielectric constant of a low permittivity dielectric on a semiconductor wafer App 20050146348 - Howland, William H. JR. ; et al.	2005-07-07
Semiconductor substrate surface preparation using high temperature convection heating App 20050028836 - Adams, Michael J. ; et al.	2005-02-10
Sample chuck with compound construction App 20030011392 - Adams, Michael John ; et al.	2003-01-16

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