Houng; Wei-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Houng; Wei-Hua.The latest application filed is for "robot arm device and method for transferring wafer".
- Houng; Wei-Hua - Hsinchu TW
- HOUNG; Wei-Hua - Hsinchu City TW
| Patent | Date |
|---|---|
| Cluster tool and method using the same Grant 11,177,150 - Houng , et al. November 16, 2 | 2021-11-16 |
| Robot Arm Device And Method For Transferring Wafer App 20210233788 - HOUNG; Wei-Hua ; et al. | 2021-07-29 |
| Robot arm device and method for transferring wafer Grant 11,004,713 - Houng , et al. May 11, 2 | 2021-05-11 |
| Orientation Chamber Of Substrate Processing System With Purging Function App 20210111016 - HOUNG; Wei-Hua | 2021-04-15 |
| Orientation chamber of substrate processing system with purging function Grant 10,854,442 - Houng December 1, 2 | 2020-12-01 |
| Robot Arm Device And Method For Transferring Wafer App 20200365436 - HOUNG; Wei-Hua ; et al. | 2020-11-19 |
| Cluster Tool And Method Using The Same App 20200294834 - HOUNG; Wei-Hua ; et al. | 2020-09-17 |
| Orientation Chamber Of Substrate Processing System With Purging Function App 20200006050 - HOUNG; Wei-Hua | 2020-01-02 |
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