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Patent applications and USPTO patent grants for HOUCHIN; Ryuzou.The latest application filed is for "plasma processing apparatus and plasma processing method".
Patent | Date |
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Plasma Processing Apparatus And Plasma Processing Method App 20140048527 - OKITA; Shogo ;   et al. | 2014-02-20 |
Plasma processing apparatus and plasma processing method Grant 8,591,754 - Okita , et al. November 26, 2 | 2013-11-26 |
Wafer reclamation method and wafer reclamation apparatus Grant 8,563,332 - Okita , et al. October 22, 2 | 2013-10-22 |
Plasma Processing Apparatus And Plasma Processing Method App 20120256363 - OKITA; Shogo ;   et al. | 2012-10-11 |
Plasma processing apparatus and plasma processing method Grant 8,231,798 - Okita , et al. July 31, 2 | 2012-07-31 |
Wafer Reclamation Method And Wafer Reclamation Apparatus App 20100173431 - Okita; Shogo ;   et al. | 2010-07-08 |
Plasma processing apparatus and plasma processing method Grant 7,736,528 - Okita , et al. June 15, 2 | 2010-06-15 |
Plasma Processing Apparatus And Plasma Processing Method App 20100051584 - OKITA; Shogo ;   et al. | 2010-03-04 |
Plasma Processing Apparatus, Plasma Processing Method, And Tray App 20090255901 - Okita; Shogo ;   et al. | 2009-10-15 |
Plasma Processing Apparatus App 20090218045 - Hiroshima; Mitsuru ;   et al. | 2009-09-03 |
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