Hou; Shang Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hou; Shang Y..The latest application filed is for "apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling".

Company Profile

0.6.4

Hou; Shang Y. - Hsin-Chu TW
Hou; Shang Y. - Hsinchu TW
Hou; Shang Y. - Summit NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling Grant 7,294,937 - Su , et al. November 13, 2	2007-11-13
Metal fuse for semiconductor devices Grant 7,205,588 - Jeng , et al. April 17, 2	2007-04-17
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling App 20060261490 - Su; Chao-Yuan ; et al.	2006-11-23
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling Grant 7,126,225 - Su , et al. October 24, 2	2006-10-24
Methodology to characterize metal sheet resistance of copper damascene process Grant 6,854,100 - Chuang , et al. February 8, 2	2005-02-08
Metal fuse for semiconductor devices App 20040219720 - Jeng, Shin-Puu ; et al.	2004-11-04
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling App 20040207078 - Su, Chao-Yuan ; et al.	2004-10-21
Metal fuse for semiconductor devices Grant 6,753,210 - Jeng , et al. June 22, 2	2004-06-22
Metal fuse for semiconductor devices App 20040053487 - Jeng, Shin-Puu ; et al.	2004-03-18
Method for making thin film tantalum oxide layers with enhanced dielectric properties and capacitors employing such layers Grant 5,948,216 - Cava , et al. September 7, 1	1999-09-07

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