HOU; NING

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOU; NING.The latest application filed is for "embedded circuit board and manufacturing method thereof".

Company Profile

12.12.15

HOU; NING - Shenzhen CN
Hou; Ning - Daqing CN
HOU; NING - Shenzhen City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedded Circuit Board And Manufacturing Method Thereof App 20220225512 - YANG; CHENG-YI ; et al.	2022-07-14
Method For Manufacturing Circuit Board With High Light Reflectivity App 20220217839 - WU; JIN-CHENG ; et al.	2022-07-07
Circuit board with high light reflectivity and method for manufacturing the same Grant 11,317,506 - Wu , et al. April 26, 2	2022-04-26
Circuit board, method for manufacturing the same, and backlight Grant 11,310,920 - Li , et al. April 19, 2	2022-04-19
Method And System For Detecting Mass Of Oil In Inorganic Mineral Of Shale App 20220057379 - Liu; Bo ; et al.	2022-02-24
Circuit Board, Method For Manufacturing The Same, And Backlight App 20210410294 - Li; Zu-Ai ; et al.	2021-12-30
Circuit Board With High Light Reflectivity And Method For Manufacturing The Same App 20210410279 - WU; JIN-CHENG ; et al.	2021-12-30
Multi-sided Light-emitting Circuit Board And Manufacturing Method Thereof App 20210384394 - Li; Zu-Ai ; et al.	2021-12-09
Method of making a rigid/flex circuit board Grant 11,140,776 - Hou , et al. October 5, 2	2021-10-05
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same Grant 11,057,709 - Li , et al. July 6, 2	2021-07-06
Method for manufacturing an ultrathin heat dissipation structure Grant 10,923,411 - Hou , et al. February 16, 2	2021-02-16
Rigid-flex Circuit Board And Method For Making Same App 20200154559 - HOU; NING ; et al.	2020-05-14
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same Grant 10,524,057 - Li , et al. Dec	2019-12-31
Method For Manufacturing An Ultrathin Heat Dissipation Structure App 20190320550 - HOU; NING ; et al.	2019-10-17
Ultrathin heat dissipation structure Grant 10,448,540 - Hou , et al. Oc	2019-10-15
Flexible Printed Circuit Board, Method For Manufacturing The Same And Loudspeaker With The Same App 20190281392 - LI; BIAO ; et al.	2019-09-12
Method for making circuit board Grant 10,383,223 - Hou , et al. A	2019-08-13
Embedded circuit board and method of making same Grant 10,356,909 - Hou , et al. July 16, 2	2019-07-16
Method For Making Circuit Board App 20190098754 - HOU; NING ; et al.	2019-03-28
Circuit board and method for making the same Grant 10,187,984 - Hou , et al. Ja	2019-01-22
Flexible Printed Circuit Board, Method For Manufacturing The Same And Loudspeaker With The Same App 20190007774 - LI; BIAO ; et al.	2019-01-03
Ultrathin Heat Dissipation Structure And A Method For Manufacturing Same App 20170325356 - HOU; NING ; et al.	2017-11-09
Rigid-flex printed circuit board and method for making same Grant 9,072,173 - Hou June 30, 2	2015-06-30
Rigid-flex Printed Circuit Board And Method For Making Same App 20140182900 - HOU; NING	2014-07-03
Flexible printed circuit board Grant 7,511,962 - Hou , et al. March 31, 2	2009-03-31
Flexible Printed Circuit Board Substrate And Flexible Printed Circuit Board Fabricated Using The Same App 20090038828 - HOU; NING ; et al.	2009-02-12
Flexible Printed Circuit Board App 20080285241 - HOU; NING ; et al.	2008-11-20

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