Hou; Dongbin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hou; Dongbin.The latest application filed is for "integrated magnetic core and winding lamina".

Company Profile

2.3.6

Hou; Dongbin - Plano TX
Hou; Dongbin - Blacksburg VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Magnetic Core And Winding Lamina App 20220310302 - Yan; Yi ; et al.	2022-09-29
Integrated inductor with magnetic mold compound Grant 11,270,937 - Hou , et al. March 8, 2	2022-03-08
Module with Reversely Coupled Inductors and Magnetic Molded Compound (MMC) App 20210375537 - Hou; Dongbin ; et al.	2021-12-02
Integrated Magnetic Device With Laminate Embedded Magnetic Core App 20210375540 - Sato; Yuki ; et al.	2021-12-02
Module with reversely coupled inductors and magnetic molded compound (MMC) Grant 11,094,455 - Hou , et al. August 17, 2	2021-08-17
Module With Reversely Coupled Inductors And Magnetic Molded Compound (mmc) App 20200211767 - HOU; Dongbin ; et al.	2020-07-02
Integrated Inductor With Magnetic Mold Compound App 20200211959 - HOU; Dongbin ; et al.	2020-07-02
Low profile coupled inductor substrate with transient speed improvement Grant 10,109,404 - Su , et al. October 23, 2	2018-10-23
Low Profile Coupled Inductor Substrate with Transient Speed Improvement App 20160086723 - Su; Yipeng ; et al.	2016-03-24

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