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name:-0.0078408718109131
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Hosoyama; Takamitsu Patent Filings

Hosoyama; Takamitsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosoyama; Takamitsu.The latest application filed is for "injection molding method for preventing formation of surface defects and mold assembly therefor".

Company Profile
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  • Hosoyama; Takamitsu - Hachiohji JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Injection molding method for preventing formation of surface defects and mold assembly therefor
Grant 5,653,932 - Aida , et al. August 5, 1
1997-08-05

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