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Hosoya; Futoshi Patent Filings

Hosoya; Futoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosoya; Futoshi.The latest application filed is for "semiconductor device and electrically-powered equipment".

Company Profile
1.9.8
  • Hosoya; Futoshi - Tokyo JP
  • Hosoya; Futoshi - Kawasaki JP
  • HOSOYA; Futoshi - Kawasaki-shi JP
  • Hosoya; Futoshi - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and electrically-powered equipment
Grant 10,243,492 - Maekawa , et al.
2019-03-26
Semiconductor Device And Electrically-powered Equipment
App 20190006969 - MAEKAWA; Atsuko ;   et al.
2019-01-03
Semiconductor device and electrically-powered equipment
Grant 10,075,111 - Maekawa , et al. September 11, 2
2018-09-11
Semiconductor Device And Electrically-powered Equipment
App 20160094168 - MAEKAWA; Atsuko ;   et al.
2016-03-31
Semiconductor device
App 20070210440 - Hosoya; Futoshi
2007-09-13
Semiconductor device including a semiconductor chip mounted on a metal base
Grant 7,242,085 - Hosoya July 10, 2
2007-07-10
Semiconductor device with a solder creep-up prevention zone
Grant 7,145,230 - Hosoya December 5, 2
2006-12-05
Semiconductor device
App 20050161802 - Hosoya, Futoshi
2005-07-28
Semiconductor device
Grant 6,882,040 - Hosoya April 19, 2
2005-04-19
Semiconductor device
Grant 6,879,033 - Hosoya April 12, 2
2005-04-12
Semiconductor device
App 20050040503 - Hosoya, Futoshi
2005-02-24
Semiconductor device
Grant 6,853,066 - Hosoya February 8, 2
2005-02-08
Semiconductor device
App 20040201034 - Hosoya, Futoshi
2004-10-14
Semiconductor device
App 20040201092 - Hosoya, Futoshi
2004-10-14
Semiconductor device
App 20040021216 - Hosoya, Futoshi
2004-02-05
Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates
Grant 6,072,122 - Hosoya June 6, 2
2000-06-06
Method for manufacturing electronic apparatus sealed by concave molded resin enveloper
Grant 5,795,799 - Hosoya August 18, 1
1998-08-18

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