Hosotani; Naoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosotani; Naoto.The latest application filed is for "method of producing flame-resistant fiber bundle and carbon fiber bundle and flameproofing furnace".

Company Profile

0.14.16

Hosotani; Naoto - Otsu-shi Shiga
Hosotani; Naoto - Iyo-gun Ehime
Hosotani; Naoto - Osaka N/A JP
Hosotani, Naoto - Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Producing Flame-resistant Fiber Bundle And Carbon Fiber Bundle And Flameproofing Furnace App 20220251736 - Takamatsu; Kohei ; et al.	2022-08-11
Oxidation Heat Treatment Oven And Method For Manufacturing Oxidized Fiber Bundle And Carbon Fiber Bundle App 20220162776 - Hosotani; Naoto ; et al.	2022-05-26
Method For Producing Flame-proof Fiber Bundle, And Method For Producing Carbon Fiber Bundle App 20210310158 - Hosotani; Naoto ; et al.	2021-10-07
Battery block Grant 9,548,477 - Asaida , et al. January 17, 2	2017-01-17
Battery module Grant 8,835,032 - Takasaki , et al. September 16, 2	2014-09-16
Battery Block App 20130344376 - Asaida; Yasuhiro ; et al.	2013-12-26
Battery Module App 20130216884 - Takasaki; Hiroshi ; et al.	2013-08-22
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,938,929 - Minamitani , et al. May 10, 2	2011-05-10
Heating And Pressurizing Apparatus For Use In Mounting Electronic Components, And Apparatus And Method For Mounting Electronic Components App 20090120998 - Minamitani; Shozo ; et al.	2009-05-14
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,490,652 - Minamitani , et al. February 17, 2	2009-02-17
Component connecting apparatus Grant 7,357,288 - Hosotani , et al. April 15, 2	2008-04-15
Pressurizing method Grant 7,076,867 - Yamamoto , et al. July 18, 2	2006-07-18
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus Grant 6,995,342 - Yamauchi , et al. February 7, 2	2006-02-07
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20060016562 - Minamitani; Shozo ; et al.	2006-01-26
Component connecting apparatus and method and component mounting apparatus App 20050034302 - Hosotani, Naoto ; et al.	2005-02-17
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus App 20050011934 - Yamauchi, Hiroshi ; et al.	2005-01-20
Component mounting apparatus Grant 6,839,959 - Hosotani , et al. January 11, 2	2005-01-11
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus Grant 6,797,926 - Yamauchi , et al. September 28, 2	2004-09-28
Pressurizing method and pressurizing apparatus App 20030145459 - Yamamoto, Akihiro ; et al.	2003-08-07
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20030121616 - Minamitani, Shozo ; et al.	2003-07-03
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus App 20030080108 - Yamauchi, Hiroshi ; et al.	2003-05-01
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 6,544,377 - Minamitani , et al. April 8, 2	2003-04-08
Method and apparatus for mounting component Grant 6,506,222 - Minamitani , et al. January 14, 2	2003-01-14
Bonding head and component mounting apparatus App 20020092887 - Hosotani, Naoto ; et al.	2002-07-18
Method and apparatus for mounting component App 20010026012 - Minamitani, Shozo ; et al.	2001-10-04
Component mounting apparatus and method Grant 6,246,789 - Hosotani , et al. June 12, 2	2001-06-12

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