Hosomi; Takeshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosomi; Takeshi.The latest application filed is for "semiconductor apparatus and method for manufacturing same".

Company Profile

0.14.16

Hosomi; Takeshi - Tokyo JP
Hosomi; Takeshi - Fujieda JP
Hosomi, Takeshi - Fujieda-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor apparatus and method for manufacturing same Grant 11,348,849 - Hosomi May 31, 2	2022-05-31
Semiconductor Apparatus And Method For Manufacturing Same App 20200176340 - HOSOMI; Takeshi	2020-06-04
Semiconductor device Grant 9,711,460 - Hosomi July 18, 2	2017-07-18
Printed circuit board Grant 9,693,462 - Hosomi June 27, 2	2017-06-27
Semiconductor Device App 20170053877 - HOSOMI; Takeshi	2017-02-23
Printed Circuit Board App 20160143148 - HOSOMI; Takeshi	2016-05-19
Article And Laminate App 20150239197 - Hosomi; Takeshi ; et al.	2015-08-27
Semiconductor device Grant 8,629,556 - Sugino , et al. January 14, 2	2014-01-14
Prepreg, method for manufacturing prepreg, substrate, and semiconductor device Grant 8,110,444 - Hosomi , et al. February 7, 2	2012-02-07
Prepreg, method for manufacturing prepreg, substrate, and semiconductor device Grant 8,044,505 - Hosomi , et al. October 25, 2	2011-10-25
Prepreg, Method For Manufacturing Prepreg, Substrate, And Semiconductor Device App 20110256367 - HOSOMI; Takeshi ; et al.	2011-10-20
Manufacturing Process For A Prepreg With A Carrier, Prepreg With A Carrier, Manufacturing Process For A Thin Double-sided Plate, Thin Double-sided Plate And Manufacturing Process For A Multilayer-printed Circuit Board App 20110120630 - YUASA; Maroshi ; et al.	2011-05-26
Prepreg, Method For Manufacturing Prepreg, Substrate, And Semiconductor Device App 20100300619 - Hosomi; Takeshi ; et al.	2010-12-02
Semiconductor device Grant 7,759,794 - Sugino , et al. July 20, 2	2010-07-20
Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board Grant 7,655,871 - Arai , et al. February 2, 2	2010-02-02
Semiconductor Device App 20090321919 - Sugino; Mitsuo ; et al.	2009-12-31
Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device App 20090302462 - Hosomi; Takeshi ; et al.	2009-12-10
Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring Board App 20090166060 - Onozuka; Iji ; et al.	2009-07-02
Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit Board App 20090126974 - Yuasa; Maroshi ; et al.	2009-05-21
Semiconductor Device App 20090039487 - Kawashima; Keiichi ; et al.	2009-02-12
Resin Composition, Resin-Attached Metal Foil, Base Material-Attached Insulating Sheet and Multiple-Layered Printed Wiring Board App 20080254300 - Arai; Masataka ; et al.	2008-10-16
Resin composition, prepreg, laminate, and semiconductor package Grant 7,368,497 - Hosomi , et al. May 6, 2	2008-05-06
Semiconductor Device App 20080042272 - Sugino; Mitsuo ; et al.	2008-02-21
Resin composition, prepreg, laminate, and semiconductor package App 20040234741 - Hosomi, Takeshi ; et al.	2004-11-25
Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device Grant 6,768,197 - Hosomi , et al. July 27, 2	2004-07-27
Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device App 20030060043 - Hosomi, Takeshi ; et al.	2003-03-27
Process for producing multilayer printed circuit board Grant 5,806,177 - Hosomi , et al. September 15, 1	1998-09-15
Undercoating agent for multilayer printed circuit board Grant 5,756,190 - Hosomi , et al. May 26, 1	1998-05-26
Resin composition and printed circuit board using the same Grant 5,726,219 - Hosomi , et al. March 10, 1	1998-03-10

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