| Patent | Date |
|---|
Semiconductor Device
App 20160079219 - Hosomi; Eiichi | 2016-03-17 |
Semiconductor Device, And Method For Manufacturing Semiconductor Device
App 20160079216 - Hosomi; Eiichi | 2016-03-17 |
Semiconductor device and method of manufacturing the same
Grant 9,153,510 - Sugimoto , et al. October 6, 2 | 2015-10-06 |
Semiconductor Device And Method Of Manufacturing The Same
App 20140353810 - Sugimoto; Masafumi ; et al. | 2014-12-04 |
Semiconductor Device, Method Of Forming A Packaged Chip Device And Chip Package
App 20140246781 - HOSOMI; Eiichi | 2014-09-04 |
Semiconductor device including semiconductor package
Grant 8,723,334 - Hosomi May 13, 2 | 2014-05-13 |
Semiconductor Device Including Semiconductor Package
App 20140027930 - HOSOMI; Eiichi | 2014-01-30 |
Semiconductor device with interface circuit and method of configuring semiconductor devices
Grant 8,183,599 - Hosomi May 22, 2 | 2012-05-22 |
Semiconductor Device With Interface Circuit And Method Of Configuring Semiconductor Devices
App 20110133252 - Hosomi; Eiichi | 2011-06-09 |
Semiconductor device with interface circuit and method of configuring semiconductor devices
Grant 7,910,956 - Hosomi March 22, 2 | 2011-03-22 |
Method Of Fabricating A Semiconductor Device And Semiconductor Production Equipment
App 20110065239 - Hosomi; Eiichi | 2011-03-17 |
System and apparatus for power distribution for a semiconductor device
Grant 7,817,439 - Hosomi October 19, 2 | 2010-10-19 |
Semiconductor Device With Interface Circuit And Method Of Configuring Semiconductor Devices
App 20100096670 - Hosomi; Eiichi | 2010-04-22 |
Method and system for an improved package substrate for use with a semiconductor package
Grant 7,531,751 - Hosomi , et al. May 12, 2 | 2009-05-12 |
Method and system for an improved power distribution network for use with a semiconductor device
Grant 7,501,698 - Hosomi March 10, 2 | 2009-03-10 |
Systems and methods for reducing simultaneous switching noise in an integrated circuit
Grant 7,492,570 - Hosomi , et al. February 17, 2 | 2009-02-17 |
Semiconductor Device Having Interposer Formed On Chip
App 20080105987 - Hosomi; Eiichi | 2008-05-08 |
Method and system for improved power distribution in a semiconductor device through use of multiple power supplies
App 20080054724 - Hosomi; Eiichi ; et al. | 2008-03-06 |
Method, system and apparatus for power distribution for a semiconductor device
App 20070297156 - Hosomi; Eiichi | 2007-12-27 |
Method and system for a semiconductor device with multiple voltage sensors and power control of semiconductor device with multiple voltage sensors
App 20070271473 - Hosomi; Eiichi | 2007-11-22 |
A Method And System For Plated Thru Hole Placement In A Substrate
App 20070245556 - Hosomi; Eiichi ; et al. | 2007-10-25 |
Method and system for a pad structure for use with a semiconductor package
Grant 7,227,260 - Goto , et al. June 5, 2 | 2007-06-05 |
Semiconductor device with interface circuit and method of configuring semiconductor devices
App 20060286754 - Hosomi; Eiichi | 2006-12-21 |
Method and system for a semiconductor package with an air vent
App 20060237829 - Hosomi; Eiichi | 2006-10-26 |
Method and system for an improved package substrate for use with a semiconductor package
App 20060237222 - Hosomi; Eiichi ; et al. | 2006-10-26 |
Systems and methods for reducing simultaneous switching noise in an integrated circuit
App 20060231947 - Hosomi; Eiichi ; et al. | 2006-10-19 |
Semiconductor packaging apparatus
Grant 7,087,988 - Hosomi August 8, 2 | 2006-08-08 |
Method and system for a pad structure for use with a semiconductor package
App 20060087028 - Goto; Yuichi ; et al. | 2006-04-27 |
Method and system for an improved power distribution network for use with a semiconductor device
App 20060087024 - Hosomi; Eiichi | 2006-04-27 |
Semiconductor package and method of manufacturing the same
Grant 6,960,494 - Funakura , et al. November 1, 2 | 2005-11-01 |
Semiconductor package and method of manufacturing the same
App 20050051810 - Funakura, Hiroshi ; et al. | 2005-03-10 |
Semiconductor package and method of manufacturing the same
Grant 6,836,012 - Funakura , et al. December 28, 2 | 2004-12-28 |
Organic substrate for flip chip bonding
Grant 6,768,206 - Hosomi July 27, 2 | 2004-07-27 |
Semiconductor device including memory unit and semiconductor module including memory units
Grant 6,740,981 - Hosomi May 25, 2 | 2004-05-25 |
Semiconductor packaging apparatus
App 20040021210 - Hosomi, Eiichi | 2004-02-05 |
Organic substrate for flip chip bonding
App 20030209807 - Hosomi, Eiichi | 2003-11-13 |
Semiconductor package and method of manufacturing the same
App 20020140095 - Funakura, Hiroshi ; et al. | 2002-10-03 |
Ball grid array type package for semiconductor device
Grant 6,376,907 - Takano , et al. April 23, 2 | 2002-04-23 |
Semiconductor apparatus and manufacturing method therefor
App 20010040280 - Funakura, Hiroshi ; et al. | 2001-11-15 |
Semiconductor device including memory unit and semiconductor module including memory units
App 20010028114 - Hosomi, Eiichi | 2001-10-11 |
Semiconductor device having bump electrodes and method of manufacturing the same
App 20010027007 - Hosomi, Eiichi ; et al. | 2001-10-04 |
Manufacturing method of semiconductor device
Grant 6,159,837 - Yamaji , et al. December 12, 2 | 2000-12-12 |
Semiconductor device using gold bumps and copper leads as bonding elements
Grant 6,049,130 - Hosomi , et al. April 11, 2 | 2000-04-11 |
Tape carrier and assembly structure thereof
Grant 5,825,081 - Hosomi , et al. October 20, 1 | 1998-10-20 |
Flip chip mounting type semiconductor device
Grant 5,801,447 - Hirano , et al. September 1, 1 | 1998-09-01 |
Semiconductor device having a bump electrode connected to an inner lead
Grant 5,773,888 - Hosomi , et al. June 30, 1 | 1998-06-30 |
Semiconductor device, method of fabricating the same and copper leads
Grant 5,747,881 - Hosomi , et al. May 5, 1 | 1998-05-05 |
Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics
Grant 5,631,499 - Hosomi , et al. May 20, 1 | 1997-05-20 |
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