Hosoma; Toshinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosoma; Toshinori.The latest application filed is for "laminate and thermal-insulation material using same".

Company Profile

0.4.7

Hosoma; Toshinori - Ube-shi JP
Hosoma; Toshinori - Yamaguchi JP
Hosoma; Toshinori - Ube JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laminate and Thermal-Insulation Material Using Same App 20140147658 - Hosoma; Toshinori ; et al.	2014-05-29
Melt-shaped Body Of Polyimide Precursor And Process For Production Of Polyimide Foam Using Same App 20130193605 - Hosoma; Toshinori ; et al.	2013-08-01
Polyimide-copper composite laminate App 20060154037 - Shimokawa; Hiroto ; et al.	2006-07-13
Method of producing through-hole in aromatic polyimide film Grant 6,596,968 - Yamamoto , et al. July 22, 2	2003-07-22
Three-dimensional wiring board and electric insulating member for wiring board Grant 6,395,992 - Nakayama , et al. May 28, 2	2002-05-28
Method of producing through-hole in aromatic polyimide film App 20020023906 - Yamamoto, Tomohiko ; et al.	2002-02-28
Roll of metal film/aromatic polyimide film composite web App 20010055691 - Yamamoto, Tomohiko ; et al.	2001-12-27
Bonded wafer, process for producing same and substrate Grant 6,198,159 - Hosoma , et al. March 6, 2	2001-03-06
Aromatic polyimide film and polyimide/copper foil composite sheet Grant 5,849,397 - Kohno , et al. December 15, 1	1998-12-15

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