| Patent | Date |
|---|
Optical waveguide device
Grant 10,185,165 - Hosokawa , et al. Ja | 2019-01-22 |
Optical modulator
Grant 10,162,201 - Miyazaki , et al. Dec | 2018-12-25 |
Optical modulator
Grant 10,078,253 - Hosokawa , et al. September 18, 2 | 2018-09-18 |
Optical waveguide element module
Grant 10,025,121 - Katou , et al. July 17, 2 | 2018-07-17 |
Optical device
Grant 9,977,270 - Ishikawa , et al. May 22, 2 | 2018-05-22 |
Optical Waveguide Device
App 20180039104 - HOSOKAWA; Youichi ; et al. | 2018-02-08 |
Optical Modulator
App 20180017839 - HOSOKAWA; Youichi ; et al. | 2018-01-18 |
System and method for restoring a status of an apparatus controlled by multiple commands
Grant 9,853,774 - Hosokawa , et al. December 26, 2 | 2017-12-26 |
Optical Modulator
App 20170307911 - Miyazaki; Norikazu ; et al. | 2017-10-26 |
Optical modulation device
Grant 9,778,539 - Miyazaki , et al. October 3, 2 | 2017-10-03 |
Optical Device
App 20170227798 - ISHIKAWA; Yoshizumi ; et al. | 2017-08-10 |
Optical Waveguide Element Module
App 20170139240 - KATOU; Kei ; et al. | 2017-05-18 |
Optical pulse-generator and optical pulse-generating method
Grant 9,570,879 - Hara , et al. February 14, 2 | 2017-02-14 |
Optical Device
App 20170012700 - HOSOKAWA; Youichi ; et al. | 2017-01-12 |
Optical device
Grant 9,523,872 - Kataoka , et al. December 20, 2 | 2016-12-20 |
System And Method For Restoring A Status Of An Apparatus Controlled By Multiple Commands
App 20160359586 - HOSOKAWA; Youichi ; et al. | 2016-12-08 |
Electro-optic Element
App 20160313579 - YOKOYAMA; Shiyoshi ; et al. | 2016-10-27 |
Optical Device
App 20160291351 - KATAOKA; Toshio ; et al. | 2016-10-06 |
Optical Modulation Device
App 20160054638 - Miyazaki; Norikazu ; et al. | 2016-02-25 |
Optical modulator
Grant 9,250,455 - Hosokawa , et al. February 2, 2 | 2016-02-02 |
Optical Pulse-generator And Optical Pulse-generating Method
App 20150029575 - Hara; Tokutaka ; et al. | 2015-01-29 |
Optical modulator
Grant 8,909,001 - Miyazaki , et al. December 9, 2 | 2014-12-09 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20140332984 - INADA; Teiichi ; et al. | 2014-11-13 |
Optical Modulator
App 20140093202 - Miyazaki; Norikazu ; et al. | 2014-04-03 |
Optical Modulator
App 20130195394 - HOSOKAWA; Youichi ; et al. | 2013-08-01 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20120080808 - Inada; Teiichi ; et al. | 2012-04-05 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
Grant 8,119,737 - Inada , et al. February 21, 2 | 2012-02-21 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20110187006 - INADA; Teiichi ; et al. | 2011-08-04 |
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
Grant 7,947,779 - Inada , et al. May 24, 2 | 2011-05-24 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20110021005 - INADA; Teiichi ; et al. | 2011-01-27 |
Adhesive Composition, Process For Producing The Same, Adhesive Film Using The Same, Substrate For Mounting Semiconductor And Semiconductor Device
App 20090186955 - INADA; Teiichi ; et al. | 2009-07-23 |
Punched Adhesive Tape For Semicconductor, Method Of Manufacturing Lead Frame With The Adhesive Tape, Lead Frame With The Adhesive Tape, And Semiconductor Device Comprising The Lead Frame
App 20090022893 - Tanabe; Yoshiyuki ; et al. | 2009-01-22 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Grant 7,449,076 - Tanabe , et al. November 11, 2 | 2008-11-11 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Grant 7,273,654 - Tanabe , et al. September 25, 2 | 2007-09-25 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20070036971 - Inada; Teiichi ; et al. | 2007-02-15 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20060106166 - Inada; Teiichi ; et al. | 2006-05-18 |
Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
App 20060100315 - Inada; Teiichi ; et al. | 2006-05-11 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
App 20060027312 - Tanabe; Yoshiyuki ; et al. | 2006-02-09 |
Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
App 20030069331 - Teiichi, Inada ; et al. | 2003-04-10 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Grant 6,523,446 - Tanabe , et al. February 25, 2 | 2003-02-25 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
App 20030021990 - Tanabe, Yoshiyuki ; et al. | 2003-01-30 |
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