Hosokawa; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosokawa; Takao.The latest application filed is for "plating apparatus and plating method".

Company Profile

2.8.6

Hosokawa; Takao - Nagaokakyo JP
HOSOKAWA; Takao - Nagaokakyo-shi JP
Hosokawa; Takao - Fukui-Ken JP
Hosokawa, Takao - Imadate-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plating apparatus and plating method Grant 11,186,919 - Hosokawa November 30, 2	2021-11-30
Plating Apparatus And Plating Method App 20200392636 - HOSOKAWA; Takao	2020-12-17
Plating apparatus and plating method Grant 10,711,365 - Hosokawa	2020-07-14
Plating Apparatus And Plating Method App 20190112728 - HOSOKAWA; Takao	2019-04-18
Capacitor and method for manufacturing the same Grant 8,508,912 - Yamamoto , et al. August 13, 2	2013-08-13
FLAT Ni PARTICLE, LAMINATED CERAMIC ELECTRONIC COMPONENT USING FLAT Ni PARTICLE, AND PRODUCTION METHOD FLAT Ni PARTICLE App 20130175176 - Hosokawa; Takao	2013-07-11
Flat Ni particle, laminated ceramic electronic component using flat Ni particle, and production method flat Ni particle Grant 8,411,410 - Hosokawa April 2, 2	2013-04-02
FLAT Ni PARTICLE, LAMINATED CERAMIC ELECTRONIC COMPONENT USING FLAT Ni PARTICLE, AND PRODUCTION METHOD FLAT Ni PARTICLE App 20120148860 - Hosokawa; Takao	2012-06-14
Capacitor And Method For Manufacturing The Same App 20110205684 - YAMAMOTO; Shigekatsu ; et al.	2011-08-25
Manufacturing method of monolithic electronic components Grant 6,729,213 - Baba , et al. May 4, 2	2004-05-04
Method for manufacturing electronic component of laminated ceramics Grant 6,475,317 - Baba , et al. November 5, 2	2002-11-05
Ceramic capacitor and manufacturing method therefor App 20020080555 - Nishiyama, Toshiki ; et al.	2002-06-27

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