HOSOI; Toshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOSOI; Toshihiro.The latest application filed is for "resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor".

Company Profile

4.8.14

HOSOI; Toshihiro - Ageo-shi JP
Hosoi; Toshihiro - Ageo JP
Hosoi; Toshihiro - Saitama JP
Hosoi; Toshihiro - Kariya JP
HOSOI; Toshihiro - Kariya-city JP
Hosoi; Toshihiro - Nagoya-city JP
Hosoi; Toshihiro - Kiyosu JP
HOSOI; Toshihiro - Kiyosu-shi JP
Hosoi; Toshihiro - Nagoya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition, Copper Foil With Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, And Printed Wiring Board With Built-in Capacitor App 20220162418 - HOSOI; Toshihiro ; et al.	2022-05-26
Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor Grant 11,310,910 - Yoneda , et al. April 19, 2	2022-04-19
Resin-clad copper foil, copper-clad laminated plate, and printed wiring board Grant 11,166,383 - Yoneda , et al. November 2, 2	2021-11-02
Copper-clad Laminate App 20210029823 - HOSOI; Toshihiro ; et al.	2021-01-28
Resin Composition, Copper Foil With Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, And Printed Wiring Board With Built-in Capacitor App 20200362169 - YONEDA; Yoshihiro ; et al.	2020-11-19
Resin Composition, Copper Foil With Resin, Dielectric Layer, Copper Clad Laminate Sheet, Capacitor Element And Printed Wiring Bo App 20200008298 - YONEDA; Yoshihiro ; et al.	2020-01-02
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board Grant 10,524,360 - Kuwako , et al. Dec	2019-12-31
Copper clad laminate provided with protective layer and multilayered printed wiring board Grant 10,244,640 - Kuwako , et al.	2019-03-26
Emergency report apparatus Grant 10,134,264 - Hosoi , et al. November 20, 2	2018-11-20
Resin-clad Copper Foil, Copper-clad Laminated Plate, And Printed Wiring Board App 20180206345 - YONEDA; Yoshihiro ; et al.	2018-07-19
Copper Clad Laminate For Forming Of Embedded Capacitor Layer, Multilayered Printed Wiring Board, And Manufacturing Method Of Multilayered Printed Wiring Board App 20180160536 - KUWAKO; Fujio ; et al.	2018-06-07
Emergency Report Apparatus App 20180089987 - HOSOI; Toshihiro ; et al.	2018-03-29
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board Grant 9,924,597 - Kuwako , et al. March 20, 2	2018-03-20
Copper Clad Laminate Provided With Protective Layer And Multilayered Printed Wiring Board App 20160360624 - KUWAKO; Fujio ; et al.	2016-12-08
Copper Clad Laminate For Forming Of Embedded Capacitor Layer, Multilayered Printed Wiring Board, And Manufacturing Method Of Multilayered Printed Wiring Board App 20160330839 - KUWAKO; Fujio ; et al.	2016-11-10
Display Apparatus For Vehicle And Information Display Device App 20140111454 - Hosoi; Toshihiro ; et al.	2014-04-24
Gas generator and airbag apparatus Grant 8,684,399 - Honda , et al. April 1, 2	2014-04-01
Gas Generator And Airbag Apparatus App 20130341892 - HONDA; Kensaku ; et al.	2013-12-26
Lead Frame and Method of Producing Lead Frame App 20110272768 - Nakamura; Toshimi ; et al.	2011-11-10
On-board hands-free communication apparatus Grant 7,756,265 - Hosoi July 13, 2	2010-07-13
On-board hands-free communication apparatus App 20080187128 - Hosoi; Toshihiro	2008-08-07
Hands free system for vehicle App 20080069371 - Hosoi; Toshihiro	2008-03-20

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