Hosoda; Kuniyasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosoda; Kuniyasu.The latest application filed is for "printed circuit board, method for forming frame ground for printed circuit board, and electronic device".

Company Profile

0.3.9

Hosoda; Kuniyasu - Hanno JP
HOSODA; Kuniyasu - Hanno-shi JP
Hosoda; Kuniyasu - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board, method for forming frame ground for printed circuit board, and electronic device Grant 8,159,833 - Ishii , et al. April 17, 2	2012-04-17
Printed circuit board, mounting method of electronic component, and electronic apparatus Grant 7,675,172 - Takizawa , et al. March 9, 2	2010-03-09
Printed Circuit Board, Method For Forming Frame Ground For Printed Circuit Board, And Electronic Device App 20090219703 - ISHII; Norihiro ; et al.	2009-09-03
Circuit Board Module, Electric Device, And Method For Producing Circuit Board Module App 20090134529 - Ishii; Norihiro ; et al.	2009-05-28
Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus App 20090001575 - Takizawa; Minoru ; et al.	2009-01-01
Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device App 20080303145 - Takizawa; Minoru ; et al.	2008-12-11
Printed Circuit Board And Electronic Apparatus App 20080173472 - Takizawa; Minoru ; et al.	2008-07-24
Module substrate and disk apparatus Grant 7,327,040 - Aoki , et al. February 5, 2	2008-02-05
Printed circuit board and electronic apparatus including printed circuit board App 20070035021 - Suzuki; Daigo ; et al.	2007-02-15
Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor device App 20060267215 - Ogawa; Hideki ; et al.	2006-11-30
Module substrate and disk apparatus App 20060103030 - Aoki; Makoto ; et al.	2006-05-18
Circuit wiring board and method of manufacturing the same App 20040083606 - Makita, Sadao ; et al.	2004-05-06

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