Hoshino; Takaaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hoshino; Takaaki.The latest application filed is for "method for pre-heating probe card".
- Hoshino; Takaaki - Nirasaki JP
- HOSHINO; Takaaki - Nirasaki City JP
- Hoshino; Takaaki - Yamanashi JP
- Hoshino; Takaaki - Yokohama JP
- Hoshino, Takaaki - Yokohama-shi JP
- Hoshino; Takaaki - Tokyo JP
| Patent | Date |
|---|---|
| Method for pre-heating probe card Grant 9,519,022 - Yamada , et al. December 13, 2 | 2016-12-13 |
| Wafer inspection apparatus Grant 9,201,115 - Yamada , et al. December 1, 2 | 2015-12-01 |
| Method for Pre-Heating Probe Card App 20150219716 - YAMADA; Hiroshi ; et al. | 2015-08-06 |
| Semiconductor Inspection System And Method For Preventing Condenation At Interface Part App 20150145540 - Komatsu; Shigekazu ; et al. | 2015-05-28 |
| Wafer Inspection Apparatus And Method For Pre-heating Probe Card App 20120062259 - YAMADA; Hiroshi ; et al. | 2012-03-15 |
| Inkjet printing apparatus, control method therefor, and program Grant 6,871,925 - Yamamoto , et al. March 29, 2 | 2005-03-29 |
| Inkjet printing apparatus, control method therefor, and program App 20040021712 - Yamamoto, Tadashi ; et al. | 2004-02-05 |
| Landing gear assembly for airplane Grant 5,482,228 - Hoshino January 9, 1 | 1996-01-09 |
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