HOSHINO; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for HOSHINO; Shinji.The latest application filed is for "sheet, moisture-proof method of adherend using the sheet and corrosion-proof method of metal plate using the sheet".

Company Profile

2.8.18

HOSHINO; Shinji - Osaka JP
Hoshino; Shinji - Ibaraki JP
HOSHINO; Shinji - Ibaraki-shi JP
Hoshino; Shinji - Ibraki-shi JP
Hoshino; Shinji - Mie JP
Hoshino; Shinji - Suzuka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sheet, Moisture-proof Method Of Adherend Using The Sheet And Corrosion-proof Method Of Metal Plate Using The Sheet App 20210402738 - JORGENSEN; Derek ; et al.	2021-12-30
Pressure-sensitive adhesive composition Grant 10,836,937 - Suzuki , et al. November 17, 2	2020-11-17
Sheet, Moisture-proof Method Of Adherend Using The Sheet And Corrosion-proof Method Of Metal Plate Using The Sheet App 20200290312 - JORGENSEN; Derek ; et al.	2020-09-17
Functionalized Laminated Optical Element with Improved Edging Resistance App 20190111641 - COUE; Violaine ; et al.	2019-04-18
Sheet, Moisture-proof Method Of Adherend Using The Sheet And Corrosion-proof Method Of Metal Plate Using The Sheet App 20180093451 - JORGENSEN; Derek ; et al.	2018-04-05
Pressure-sensitive Adhesive Composition App 20160369136 - SUZUKI; Tatsuya ; et al.	2016-12-22
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape App 20130240141 - SOEJIMA; Kazuki ; et al.	2013-09-19
Pressure-sensitive Adhesive Tape For Resin Encapsulation And Method For Producing Resin Encapsulation Type Semiconductor Device App 20130237017 - KONDO; Hiroyuki ; et al.	2013-09-12
Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet Grant 8,502,397 - Yanagi , et al. August 6, 2	2013-08-06
Method Of Separating Two Adhered Plates App 20130186572 - FUJITA; Masato ; et al.	2013-07-25
Method Of Separating Two Adhered Plates App 20130186575 - FUJITA; Masato ; et al.	2013-07-25
Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet Grant 8,436,481 - Hoshino , et al. May 7, 2	2013-05-07
Method And Apparatus For Detaching Plates Joined To Each Other App 20130020031 - FUJITA; Masato ; et al.	2013-01-24
Optical Double-sided Pressure-sensitive Adhesive Sheet, Optical Member, Touch Panel, Image Display Device, And Separating Method App 20130005928 - HOSHINO; Shinji ; et al.	2013-01-03
Heat-resistant Adhesive Sheet For Substrateless Semiconductor Package Fabrication And Method For Fabricating Substrateless Semiconductor Package Using The Adhesive Sheet App 20110151625 - HOSHINO; Shinji ; et al.	2011-06-23
Heat-resistant Adhesive Sheet For Semiconductor Device Fabrication, Adhesive Used For The Sheet, And Method For Fabricating Semiconductor Device Using The Sheet App 20110143552 - YANAGI; Yuichiro ; et al.	2011-06-16
Adhesive Tape For Resin-encapsulating And Method Of Manufacture Of Resin-encapsulated Semiconductor Device App 20110111563 - YANAGI; Yuichiro ; et al.	2011-05-12
Tip dresser Grant 7,789,600 - Goto , et al. September 7, 2	2010-09-07
Tip Dresser App 20090279974 - Goto; Tadashi ; et al.	2009-11-12
Dressing apparatus for an electrode tip Grant 5,445,481 - Nakajima , et al. August 29, 1	1995-08-29
Rotative cutting tool of tip dresser Grant 5,401,127 - Nakajima , et al. March 28, 1	1995-03-28

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