Patent | Date |
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Signal Processing Device, Signal Processing Method, Program, And Imaging Device App 20220309848 - HOSHINO; KAZUHIRO ;   et al. | 2022-09-29 |
Optical thin film and manufacturing method of optical element Grant 11,346,983 - Matsumoto , et al. May 31, 2 | 2022-05-31 |
Imaging System, Method Of Controlling Imaging System, And Object Recognition System App 20220166958 - Hoshino; Kazuhiro ;   et al. | 2022-05-26 |
Vehicular Image Capturing System And Image Capturing Method App 20220161728 - HIRATA; AYAKA ;   et al. | 2022-05-26 |
Image processing device, imaging device, and image processing method Grant 11,244,209 - Hoshino February 8, 2 | 2022-02-08 |
Imaging Device And Imaging Element App 20210399026 - HOSHINO; KAZUHIRO | 2021-12-23 |
Image processing device, imaging device, and image processing method Grant 10,885,403 - Hoshino January 5, 2 | 2021-01-05 |
Image Processing Device, Imaging Device, And Image Processing Method App 20200401859 - Hoshino; Kazuhiro | 2020-12-24 |
Imaging apparatus and imaging apparatus control method to reduce power consumption without reduction of number of pixel signals Grant 10,863,129 - Hoshino , et al. December 8, 2 | 2020-12-08 |
Image Capturing Device, Image Capturing Method, And Image Capturing System App 20200342607 - HOSHINO; KAZUHIRO ;   et al. | 2020-10-29 |
Imaging Apparatus, And Imaging Apparatus Control Method App 20190327440 - HOSHINO; KAZUHIRO ;   et al. | 2019-10-24 |
Image Processing Device, Imaging Device, And Image Processing Method App 20190147306 - Hoshino; Kazuhiro | 2019-05-16 |
Image processing device, imaging device, and image processing method Grant 10,217,034 - Hoshino Feb | 2019-02-26 |
Optical Thin Film And Manufacturing Method Of Optical Element App 20180306949 - Matsumoto; Seiken ;   et al. | 2018-10-25 |
Film deposition apparatus and film deposition method Grant 9,951,415 - Murakami , et al. April 24, 2 | 2018-04-24 |
Image Processing Device, Imaging Device, And Image Processing Method App 20170357881 - Hoshino; Kazuhiro | 2017-12-14 |
Water-stop structure for wire harness Grant 9,721,699 - Shiba , et al. August 1, 2 | 2017-08-01 |
Film Deposition Apparatus And Film Deposition Method App 20160312353 - Murakami; Yasuo ;   et al. | 2016-10-27 |
Water-stop Structure For Wire Harness App 20150122544 - SHIBA; Gen ;   et al. | 2015-05-07 |
Heat-resistant Copper Foil And Method Of Producing The Same, Circuit Board, And Copper-clad Laminate And Method Of Producing The Same App 20120205146 - Oguro; Ryoichi ;   et al. | 2012-08-16 |
Copper Foil With Resistance Layer, Method Of Production Of The Same And Laminated Board App 20120111613 - Oguro; Ryoichi ;   et al. | 2012-05-10 |
Method of processing noise in image data, noise reduction unit, and imaging apparatus Grant 8,149,302 - Hoshino , et al. April 3, 2 | 2012-04-03 |
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,985,488 - Suzuki , et al. July 26, 2 | 2011-07-26 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil Grant 7,985,485 - Moteki , et al. July 26, 2 | 2011-07-26 |
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil App 20110171486 - MOTEKI; Takami ;   et al. | 2011-07-14 |
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,892,655 - Suzuki , et al. February 22, 2 | 2011-02-22 |
Method Of Processing Noise In Image Data, Noise Reduction Unit, And Imaging Apparatus App 20100283873 - HOSHINO; Kazuhiro ;   et al. | 2010-11-11 |
Method of processing noise in image data, noise reduction unit, and imaging apparatus Grant 7,825,964 - Hoshino , et al. November 2, 2 | 2010-11-02 |
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same App 20100270063 - Suzuki; Yuuji ;   et al. | 2010-10-28 |
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,771,841 - Suzuki , et al. August 10, 2 | 2010-08-10 |
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil App 20090324988 - Moteki; Takami ;   et al. | 2009-12-31 |
Method of manufacturing a solid state image pickup apparatus having multiple transmission paths Grant 7,579,576 - Sugiyama , et al. August 25, 2 | 2009-08-25 |
Solid-state image pickup apparatus and control method thereof Grant 7,521,656 - Sugiyama , et al. April 21, 2 | 2009-04-21 |
Imaging element, imaging device, camera module and camera system Grant 7,414,663 - Hoshino , et al. August 19, 2 | 2008-08-19 |
Imaging element, imaging device, camera module and camera system Grant 7,375,757 - Hoshino , et al. May 20, 2 | 2008-05-20 |
Method of processing noise in image data, noise reduction unit, and imaging apparatus App 20080079827 - Hoshino; Kazuhiro ;   et al. | 2008-04-03 |
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same App 20070154692 - Suzuki; Yuuji ;   et al. | 2007-07-05 |
Ultrathin copper foil with carrier and printed circuit board using same App 20070141381 - Suzuki; Yuuji ;   et al. | 2007-06-21 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil App 20070042212 - Moteki; Takami ;   et al. | 2007-02-22 |
Copper foil for high-density ultra-fine printed wiring board Grant 7,175,920 - Suzuki , et al. February 13, 2 | 2007-02-13 |
Copper foil for high-density ultrafine printed wiring boad Grant 7,026,059 - Suzuki , et al. April 11, 2 | 2006-04-11 |
Copper foil for high-density ultra-fine printed wiring board App 20050249927 - Suzuki, Akitoshi ;   et al. | 2005-11-10 |
Solid-state image pickup apparatus and control method thereof App 20050174612 - Sugiyama, Toshinobu ;   et al. | 2005-08-11 |
Solid-state image pickup apparatus and control method thereof App 20050173618 - Sugiyama, Toshinobu ;   et al. | 2005-08-11 |
Imaging element, imaging device, camera module and camera system App 20050104991 - Hoshino, Kazuhiro ;   et al. | 2005-05-19 |
Solid-state image pickup apparatus and control method thereof Grant 6,858,827 - Sugiyama , et al. February 22, 2 | 2005-02-22 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil App 20050019599 - Moteki, Takami ;   et al. | 2005-01-27 |
Image pick-up device, camera module and camera system Grant 6,759,642 - Hoshino July 6, 2 | 2004-07-06 |
Copper foil for high-density ultrafine printed wiring boad App 20040038049 - Suzuki, Akitoshi ;   et al. | 2004-02-26 |
Solid-state image pickup apparatus and control method thereof App 20030052252 - Sugiyama, Toshinobu ;   et al. | 2003-03-20 |
Semiconductor device a burried wiring structure and process for fabricating the same Grant 6,395,627 - Hoshino , et al. May 28, 2 | 2002-05-28 |
Image pickup device, camera module and camera system App 20010030276 - Hoshino, Kazuhiro | 2001-10-18 |
Process for fabricating connection structures Grant 5,776,830 - Sumi , et al. July 7, 1 | 1998-07-07 |
Wire harness connector cover Grant 5,444,182 - Hoshino August 22, 1 | 1995-08-22 |
Wire harness connector cover Grant 5,315,062 - Hoshino May 24, 1 | 1994-05-24 |
Semiconductor device using copper metallization Grant 4,985,750 - Hoshino January 15, 1 | 1991-01-15 |
Method of producing semiconductor device Grant 4,910,169 - Hoshino March 20, 1 | 1990-03-20 |