loadpatents
name:-0.053864002227783
name:-0.035753965377808
name:-0.0092520713806152
Hoshino; Hitoshi Patent Filings

Hoshino; Hitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hoshino; Hitoshi.The latest application filed is for "method of processing a wafer".

Company Profile
9.37.54
  • Hoshino; Hitoshi - Munich DE
  • Hoshino; Hitoshi - Kariya JP
  • HOSHINO; Hitoshi - Kariya-city JP
  • Hoshino; Hitoshi - Tokyo JP
  • Hoshino; Hitoshi - Ota-ku JP
  • HOSHINO; Hitoshi - Nagoya-city JP
  • Hoshino; Hitoshi - Nagoya JP
  • Hoshino; Hitoshi - Toyota JP
  • Hoshino; Hitoshi - Aichi JP
  • Hoshino; Hitoshi - Nagoya-shi JP
  • Hoshino; Hitoshi - Toyota-shi JP
  • Hoshino; Hitoshi - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of producing a substrate and system for producing a substrate
Grant 11,201,126 - Priewasser , et al. December 14, 2
2021-12-14
Method of processing a wafer
Grant 11,133,219 - Priewasser , et al. September 28, 2
2021-09-28
Method Of Processing A Wafer
App 20210183704 - PRIEWASSER; Karl Heinz ;   et al.
2021-06-17
Method Of Processing A Workpiece And System For Processing A Workpiece
App 20200381303 - HOSHINO; Hitoshi ;   et al.
2020-12-03
Method Of Producing A Substrate And System For Producing A Substrate
App 20200251431 - Kind Code
2020-08-06
Image generation device
Grant 10,733,962 - Hoshino , et al.
2020-08-04
Method of processing a wafer
Grant 10,727,128 - Priewasser , et al.
2020-07-28
Method of processing a substrate
Grant 10,682,728 - Priewasser , et al.
2020-06-16
Display control device
Grant 10,650,775 - Kajita , et al.
2020-05-12
Method Of Processing A Wafer
App 20190252254 - PRIEWASSER; Karl Heinz ;   et al.
2019-08-15
Method Of Processing A Wafer
App 20190221480 - PRIEWASSER; Karl Heinz ;   et al.
2019-07-18
Display Control Device
App 20190114988 - KAJITA; Kentaro ;   et al.
2019-04-18
Method of processing a wafer and wafer processing system
Grant 10,242,913 - Priewasser , et al.
2019-03-26
Wafer processing method
Grant 10,211,076 - Tsuchiya , et al. Feb
2019-02-19
Method Of Processing A Substrate
App 20190030648 - Priewasser; Karl Heinz ;   et al.
2019-01-31
Method Of Processing A Wafer And Wafer Processing System
App 20180211877 - Priewasser; Karl Heinz ;   et al.
2018-07-26
Image Generation Device
App 20180182358 - HOSHINO; Hitoshi ;   et al.
2018-06-28
Method of processing a wafer and wafer processing system
Grant 9,935,010 - Priewasser , et al. April 3, 2
2018-04-03
Method Of Processing A Wafer And Wafer Processing System
App 20170365519 - Priewasser; Karl ;   et al.
2017-12-21
Wafer Processing Method
App 20170301571 - Tsuchiya; Toshio ;   et al.
2017-10-19
Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element
Grant 9,455,229 - Aida , et al. September 27, 2
2016-09-27
Single Crystal Substrate, Manufacturing Method For Single Crystal Substrate, Manufacturing Method For Single Crystal Substrate With Multilayer Film, And Element Manufacturing Method
App 20160265140 - AIDA; Hideo ;   et al.
2016-09-15
Method for manufacturing light-emitting element, and light-emitting element
Grant 9,065,032 - Aida , et al. June 23, 2
2015-06-23
Composite Substrate Manufacturing Method, Semiconductor Element Manufacturing Method, Composite Substrate, And Semiconductor Element
App 20150076662 - Aida; Hideo ;   et al.
2015-03-19
Splitting method for optical device wafer
Grant 8,946,056 - Ueno , et al. February 3, 2
2015-02-03
Method For Manufacturing Light-emitting Element, And Light-emitting Element
App 20140217458 - Aida; Hideo ;   et al.
2014-08-07
Sapphire wafer dividing method
Grant 8,673,695 - Okamura , et al. March 18, 2
2014-03-18
Sapphire wafer dividing method
Grant 8,518,730 - Hoshino , et al. August 27, 2
2013-08-27
Processing method for wafer
Grant 8,497,189 - Hoshino July 30, 2
2013-07-30
Processing Method For Wafer
App 20130189806 - Hoshino; Hitoshi
2013-07-25
Single Crystal Substrate, Manufacturing Method For Single Crystal Substrate, Manufacturing Method For Single Crystal Substrate With Multilayer Film, And Element Manufacturing Method
App 20130161797 - Aida; Hideo ;   et al.
2013-06-27
Internally Reformed Substrate For Epitaxial Growth, Internally Reformed Substrate With Multilayer Film, Semiconductor Device, Bulk Semiconductor Substrate, And Manufacturing Methods Therefor
App 20130161794 - Aida; Hideo ;   et al.
2013-06-27
Single Crystal Substrate With Multilayer Film, Manufacturing Method For Single Crystal Substrate With Multilayer Film, And Element Manufacturing Method
App 20130082358 - Aida; Hideo ;   et al.
2013-04-04
Crystalline Film, Device, And Manufacturing Methods For Crystalline Film And Device
App 20130062734 - Aida; Hideo ;   et al.
2013-03-14
Light emitting device and manufacturing method thereof
Grant 8,318,518 - Hoshino , et al. November 27, 2
2012-11-27
Splitting Method For Optical Device Wafer
App 20120289026 - Ueno; Hiroumi ;   et al.
2012-11-15
Sapphire Wafer Dividing Method
App 20120156816 - Okamura; Takashi ;   et al.
2012-06-21
Sapphire Wafer Dividing Method
App 20120083059 - Hoshino; Hitoshi ;   et al.
2012-04-05
Inside Reforming Substrate For Epitaxial Growth; Crystal Film Forming Element, Device, And Bulk Substrate Produced Using The Same; And Method For Producing The Same
App 20120018732 - Aida; Hideo ;   et al.
2012-01-26
Method of processing optical device wafer
Grant 8,048,780 - Hoshino , et al. November 1, 2
2011-11-01
Laser processing machine
Grant 8,049,134 - Nomaru , et al. November 1, 2
2011-11-01
In-vehicle Display Device
App 20110254863 - HOSHINO; Hitoshi
2011-10-20
Image data communication in image processing system
Grant 8,040,536 - Ito , et al. October 18, 2
2011-10-18
Vehicle wiper apparatus
Grant 8,028,367 - Makihara , et al. October 4, 2
2011-10-04
Method of processing optical device wafer
Grant 7,977,215 - Hoshino , et al. July 12, 2
2011-07-12
Light Emitting Device And Manufacturing Method Thereof
App 20110133235 - Hoshino; Hitoshi ;   et al.
2011-06-09
Method, system and computer program product for generating program
Grant 7,802,237 - Hoshino , et al. September 21, 2
2010-09-21
Working method for an optical device wafer
Grant 7,745,311 - Hoshino , et al. June 29, 2
2010-06-29
Control apparatus and its method, and control program and storage medium holding it
Grant 7,738,131 - Hoshino , et al. June 15, 2
2010-06-15
Working Method For An Optical Device Wafer
App 20100047999 - Hoshino; Hitoshi ;   et al.
2010-02-25
Method Of Processing Optical Device Wafer
App 20100041210 - Hoshino; Hitoshi ;   et al.
2010-02-18
Optical device wafer dividing method
Grant 7,662,700 - Hoshino , et al. February 16, 2
2010-02-16
Method Of Processing Optical Device Wafer
App 20100035408 - Hoshino; Hitoshi ;   et al.
2010-02-11
Optical Device Wafer Dividing Method
App 20090311848 - Hoshino; Hitoshi ;   et al.
2009-12-17
Data transfer method and image formation system
Grant 7,548,333 - Tokura , et al. June 16, 2
2009-06-16
Laser Processing Machine
App 20080290078 - Nomaru; Keiji ;   et al.
2008-11-27
Control Apparatus And Its Method, And Control Program And Storage Medium Holding It
App 20080275961 - Hoshino; Hitoshi ;   et al.
2008-11-06
Control apparatus and its method, and control program and storage medium holding it, with access designating second address being performed based on link to the second address included in display information
Grant 7,408,661 - Hoshino , et al. August 5, 2
2008-08-05
Method for laser processing of wafer
Grant 7,396,780 - Hoshino , et al. July 8, 2
2008-07-08
Workpiece dividing method utilizing laser beam
App 20080128953 - Nagai; Yusuke ;   et al.
2008-06-05
Method of processing sapphire substrate
App 20080003708 - Hoshino; Hitoshi ;   et al.
2008-01-03
Control Apparatus And Its Method, And Control Program And Storage Medium Holding It, With Changing Of Transmission Source
App 20070156920 - Hoshino; Hitoshi ;   et al.
2007-07-05
Vehicle wiper apparatus
App 20060282971 - Makihara; Hiroaki ;   et al.
2006-12-21
Wafer laser processing method and laser beam processing machine
App 20060255022 - Hoshino; Hitoshi ;   et al.
2006-11-16
Wafer processing method
Grant 7,134,942 - Nagai , et al. November 14, 2
2006-11-14
Method of laser processing a gallium nitride substrate
App 20060099774 - Hoshino; Hitoshi
2006-05-11
Method for laser processing of wafer
App 20060094260 - Hoshino; Hitoshi ;   et al.
2006-05-04
Laser processing method
App 20060035411 - Oba; Ryugo ;   et al.
2006-02-16
Method, system and computer program product for generating program
App 20060020949 - Hoshino; Hitoshi ;   et al.
2006-01-26
Semiconductor wafer processing method
App 20050155954 - Oba, Ryugo ;   et al.
2005-07-21
Wafer processing method
App 20050059325 - Nagai, Yusuke ;   et al.
2005-03-17
Image data communication in image processing system
App 20040257390 - Ito, Yoshinori ;   et al.
2004-12-23
Workpiece dividing method utilizing laser beam
App 20040232124 - Nagai, Yusuke ;   et al.
2004-11-25
Data transfer method and image formation system
App 20040125389 - Tokura, Yutaka ;   et al.
2004-07-01
LSI package and internal connecting method used therefor
Grant 6,653,168 - Hoshino , et al. November 25, 2
2003-11-25
LSI package and internal connecting method used therefor
App 20030122234 - Hoshino, Hitoshi ;   et al.
2003-07-03
Control apparatus and its method, and control program and storage medium holding it
App 20030074420 - Hoshino, Hitoshi ;   et al.
2003-04-17
LSI package and internal connecting method used therefor
App 20010050426 - Hoshino, Hitoshi ;   et al.
2001-12-13
Hand-held mobile phone terminal
Grant 6,061,579 - Arai , et al. May 9, 2
2000-05-09
Dry etching of metal film
Grant 4,350,563 - Takada , et al. September 21, 1
1982-09-21

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