Hoshi; Tadahide
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hoshi; Tadahide.The latest application filed is for "manufacturing method of semiconductor substrate and inspection method therefor".
- Hoshi; Tadahide - Kitakyushu JP
- Hoshi; Tadahide - Yokohama JP
| Patent | Date |
|---|---|
| Manufacturing method of semiconductor substrate and inspection method therefor Grant 5,951,755 - Miyashita , et al. September 14, 1 | 1999-09-14 |
| Method of manufacturing semiconductor substrate Grant 5,352,625 - Hoshi October 4, 1 | 1994-10-04 |
| Apparatus for bonding semiconductor substrates Grant 5,273,553 - Hoshi , et al. December 28, 1 | 1993-12-28 |
| Method for manufacturing bonded semiconductor body Grant 5,196,375 - Hoshi March 23, 1 | 1993-03-23 |
| Method for bonding semiconductor substrates Grant 5,129,827 - Hoshi , et al. July 14, 1 | 1992-07-14 |
| Method of manufacturing semiconductor device including substrate bonding and outdiffusion by thermal heating Grant 4,935,386 - Nakagawa , et al. June 19, 1 | 1990-06-19 |
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