Hosaka; Yukio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hosaka; Yukio.The latest application filed is for "microorganism concentrator".

Company Profile

1.34.31

Hosaka; Yukio - Hiroshima JP
Hosaka; Yukio - Minato-ku JP
Hosaka; Yukio - Tokyo JP
Hosaka; Yukio - Hachioji JP
Hosaka; Yukio - Tsu N/A JP
Hosaka; Yukio - Chuo-ku JP
Hosaka; Yukio - Mie JP
Hosaka; Yukio - Higashihiroshima JP
Hosaka; Yukio - Fukuyama JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microorganism concentrator Grant 10,260,997 - Fukuyo , et al.	2019-04-16
Electrode material, electrode and electrical storage device Grant 10,081,547 - Chung , et al. September 25, 2	2018-09-25
Method for examining microorganisms and examination apparatus for microorganisms Grant 9,915,601 - Nakata , et al. March 13, 2	2018-03-13
Sewing machine Grant 9,909,243 - Hosaka , et al. March 6, 2	2018-03-06
Method for examining microorganisms Grant 9,856,506 - Hosaka , et al. January 2, 2	2018-01-02
Production process for electrode material, electrode and electric storage device Grant 9,543,079 - Tanaka , et al. January 10, 2	2017-01-10
Microorganism Concentrator App 20160370261 - Fukuyo; Yasuo ; et al.	2016-12-22
Sewing Machine App 20160289876 - Hosaka; Yukio ; et al.	2016-10-06
Stitchwork status checking system, stitchwork status checking apparatus, stitchwork status checking method and stitchwork status checking program Grant 9,458,560 - Kongo , et al. October 4, 2	2016-10-04
Method For Examining Microorganisms App 20160122796 - Hosaka; Yukio ; et al.	2016-05-05
Embroidery cloth presser Grant 9,279,204 - Tomizawa , et al. March 8, 2	2016-03-08
Electrode Material, Electrode And Electrical Storage Device App 20160060125 - CHUNG; Kang Ko ; et al.	2016-03-03
Imprinter including an elastic member for elastically supporting the roller shaft Grant 9,193,200 - Hosaka November 24, 2	2015-11-24
Method for Examining Microorganisms and Examination Apparatus for Microorganisms App 20150219548 - Nakata; Akiko ; et al.	2015-08-06
Stitchwork status checking system, stitchwork status checking apparatus, stitchwork status checking method and stitchwork status checking program Grant 8,972,039 - Kongo , et al. March 3, 2	2015-03-03
Production Process For Electrode Material, Electrode And Electric Storage Device App 20150048273 - TANAKA; Ryo ; et al.	2015-02-19
Stichwork Status Checking System, Stitchwork Status Checking Apparatus, Stitchwork Status Checking Method And Stitchwork Status Checking Program App 20150045939 - KONGO; Takeshi ; et al.	2015-02-12
Stitchwork Status Checking System, Stitchwork Status Checking Apparatus, Stitchwork Status Checking Method And Stitchwork Status Checking Program App 20150040810 - KONGO; Takeshi ; et al.	2015-02-12
Chemical-mechanical polishing pad and chemical-mechanical polishing method Grant 8,944,888 - Kubo , et al. February 3, 2	2015-02-03
Embroidery Cloth Presser App 20140216316 - Tomizawa; Shigeru ; et al.	2014-08-07
Chemical-mechanical Polishing Pad And Chemical-mechanical Polishing Method App 20130189907 - Kubo; Kotaro ; et al.	2013-07-25
Imprinter including a roller with an elastic member being radially deformed during an imprinting operation Grant 8,479,649 - Hosaka July 9, 2	2013-07-09
Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method Grant 8,388,799 - Kuwabara , et al. March 5, 2	2013-03-05
Imprinter App 20100229739 - Hosaka; Yukio	2010-09-16
Method for producing chemical mechanical polishing pad Grant 7,790,788 - Hosaka , et al. September 7, 2	2010-09-07
Composition For Forming Polishing Layer Of Chemical Mechanical Polishing Pad, Chemical Mechanical Polishing Pad And Chemical Mechanical Polishing Method App 20090191795 - KUWABARA; Rikimaru ; et al.	2009-07-30
Method For Producing Chemical Mechanical Polishing Pad App 20090104856 - HOSAKA; Yukio ; et al.	2009-04-23
Chemical Mechanical Polishing Pad And Method For Manufacturing Same App 20090053983 - Hosaka; Yukio ; et al.	2009-02-26
Imprinter App 20080134910 - Hosaka; Yukio	2008-06-12
Method of manufacturing chemical mechanical polishing pad Grant 7,329,174 - Hosaka , et al. February 12, 2	2008-02-12
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer Grant 7,323,415 - Shiho , et al. January 29, 2	2008-01-29
Polishing body Grant 7,217,305 - Hasegawa , et al. May 15, 2	2007-05-15
Method of manufacturing chemical mechanical polishing pad App 20070082587 - Hosaka; Yukio ; et al.	2007-04-12
Polishing body Grant 7,201,641 - Hasegawa , et al. April 10, 2	2007-04-10
Chemical mechanical polishing pad and chemical mechanical polishing method Grant 7,183,213 - Shiho , et al. February 27, 2	2007-02-27
Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer App 20060128271 - Shiho; Hiroshi ; et al.	2006-06-15
Polishing body App 20060116054 - Hasegawa; Kou ; et al.	2006-06-01
Polishing body App 20060075686 - Hasegawa; Kou ; et al.	2006-04-13
Abrasive material Grant 7,001,252 - Hasegawa , et al. February 21, 2	2006-02-21
Polishing pad Grant 6,976,910 - Hosaka , et al. December 20, 2	2005-12-20
Chemical mechanical polishing pad and chemical mechanical polishing method App 20050260929 - Shiho, Hiroshi ; et al.	2005-11-24
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers App 20050245171 - Hosaka, Yukio ; et al.	2005-11-03
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method App 20050239380 - Hosaka, Yukio ; et al.	2005-10-27
Polishing pad for semiconductor wafer and polishing process using thereof Grant 6,848,974 - Hasegawa , et al. February 1, 2	2005-02-01
Chemical mechanical polishing pad and chemical mechanical polishing method App 20050014376 - Shiho, Hiroshi ; et al.	2005-01-20
Polishing pad App 20050003749 - Hosaka, Yukio ; et al.	2005-01-06
Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method App 20040203320 - Hosaka, Yukio ; et al.	2004-10-14
Composition for polishing pad and polishing pad therewith App 20040063391 - Hosaka, Yukio ; et al.	2004-04-01
Method of diagnosing nutritious condition of crop in plant field Grant 6,683,970 - Satake , et al. January 27, 2	2004-01-27
Polishing pad and multi-layer polishing pad App 20040014413 - Kawahashi, Nobuo ; et al.	2004-01-22
Abrasive material App 20030153255 - Hasegawa, Kou ; et al.	2003-08-14
Polishing pad for semiconductor wafer and polishing process using thereof App 20030060138 - Hasegawa, Kou ; et al.	2003-03-27
Method of diagnosing nutritious condition of crop in plant field Grant 6,466,321 - Satake , et al. October 15, 2	2002-10-15
Method for determining amount of fertilizer application for grain crops, method for estimating quality and yield of grains and apparatus for providing grain production information Grant 6,442,486 - Satake , et al. August 27, 2	2002-08-27
Thermoplastic resin composition having excellent long-term heat-aging properties App 20010011116 - Kurata, Takashi ; et al.	2001-08-02
Milling apparatus and system therefor Grant 5,050,808 - Satake , et al. September 24, 1	1991-09-24
Method for evaluating quality of raw coffee beans Grant 5,034,609 - Satake , et al. * July 23, 1	1991-07-23
Apparatus for evaluating quality of raw coffee beans Grant 4,963,743 - Satake , et al. October 16, 1	1990-10-16
Apparatus for continuously measuring the degree of milling of grains Grant 4,540,286 - Satake , et al. September 10, 1	1985-09-10
Method and apparatus for non-contact measurement of a gauge of a high temperature material Grant 4,027,978 - Yamamoto , et al. June 7, 1	1977-06-07

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