Horsford; Kibby B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horsford; Kibby B..The latest application filed is for "integrated circuit package using polymer-solder ball structures and forming methods".
- Horsford; Kibby B. - Essex Junction VT
- Horsford; Kibby B. - Essex VT
- Horsford; Kibby B - Essex VT
- Horsford; Kibby B. - Charlotte VT
| Patent | Date |
|---|---|
| Integrated Circuit Package Using Polymer-solder Ball Structures And Forming Methods App 20170271285 - Graf; Richard S. ; et al. | 2017-09-21 |
| Wafer-level chip-scale package structure utilizing conductive polymer Grant 9,496,234 - Graf , et al. November 15, 2 | 2016-11-15 |
| Mask and substrate alignment for solder bump process Grant 7,670,437 - Allen , et al. March 2, 2 | 2010-03-02 |
| Mask And Substrate Alignment For Solder Bump Process App 20080202421 - Allen; Duane E. ; et al. | 2008-08-28 |
| Mask and substrate alignment for solder bump process Grant 7,410,919 - Allen , et al. August 12, 2 | 2008-08-12 |
| Mask And Substrate Alignment For Solder Bump Process App 20040261977 - Allen, Duane E. ; et al. | 2004-12-30 |
| Planarized plastic package modules for integrated circuits Grant 6,603,195 - Caletka , et al. August 5, 2 | 2003-08-05 |
| Method and apparatus for testing integrated circuit chips Grant 5,528,159 - Charlton , et al. June 18, 1 | 1996-06-18 |
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