Horsfield; Brian C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Horsfield; Brian C..The latest application filed is for "trim device for a lamination assembly".

Company Profile

0.4.7

Horsfield; Brian C. - Federal Way WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Trim device for a lamination assembly App 20080236349 - Horsfield; Brian C. ; et al.	2008-10-02
Process for encapsulation of cellulose based substrates using electromagnetic radiation heating Grant 7,384,497 - Christensen , et al. June 10, 2	2008-06-10
Process for encapsulation of cellulose based substrate using non-electromagnetic heating Grant 7,247,216 - Muise, Jr., legal representative , et al. July 2	2007-07-24
Cellulose-based substrates encapsulated with polymeric films and adhesive App 20070151685 - Horsfield; Brian C. ; et al.	2007-07-05
Process for encapsulation of cellulose based substrate using non-electromagnetic heating App 20050284565 - Muise, Herbert D. ; et al.	2005-12-29
Process for encapsulation of cellulose based substrates using electromagnetic radiation heating App 20050284563 - Christensen, Elmer ; et al.	2005-12-29
Process for encapsulation of cellulose based substrates using adhesive App 20050284564 - Horsfield, Brian C. ; et al.	2005-12-29
Cellulose based substrates encapsulated with polymeric films and adhesive App 20050287321 - Horsfield, Brian C. ; et al.	2005-12-29
Engineered wood member and method of its manufacture Grant 6,635,141 - Horsfield , et al. October 21, 2	2003-10-21
Engineered wood member and method of its manufacture App 20020043042 - Horsfield, Brian C. ; et al.	2002-04-18
Engineered wood member Grant 6,318,046 - Horsfield , et al. November 20, 2	2001-11-20

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