Horng; Horng Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horng; Horng Chih.The latest application filed is for "solder spattering suppressed reflow method".
- Horng; Horng Chih - Hsinchu TW
- HORNG; HORNG CHIH - HSINCHU CITY 300 TW
- HORNG; HORNG CHIH - HSINCHU CITY TW
| Patent | Date |
|---|---|
| Flip chip package manufacturing method Grant 8,936,968 - Horng January 20, 2 | 2015-01-20 |
| Gas concentration control device for pressure vessel Grant 8,695,623 - Horng April 15, 2 | 2014-04-15 |
| Solder Spattering Suppressed Reflow Method App 20130119119 - HORNG; HORNG CHIH | 2013-05-16 |
| Flip Chip Package Manufacturing Method App 20130065362 - HORNG; HORNG CHIH | 2013-03-14 |
| Gas Concentration Control Device For Pressure Vessel App 20130037126 - HORNG; HORNG CHIH | 2013-02-14 |
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