Horng; Ching-Fu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horng; Ching-Fu.The latest application filed is for "circuit carrier and manufacturing process thereof".
- Horng; Ching-Fu - Kaohsiung TW
- Horng; Ching-Fu - Kaohsiung City TW
- Horng; Ching-Fu - Magung TW
- Horng, Ching-Fu - Magung City TW
- Horng; Ching-Fu - Penghu TW
| Patent | Date |
|---|---|
| Manufacturing method of a multi-layer circuit board embedded with a passive component Grant 7,523,551 - Horng , et al. April 28, 2 | 2009-04-28 |
| Circuit carrier and manufacturing process thereof Grant 7,338,892 - Wang , et al. March 4, 2 | 2008-03-04 |
| Circuit Carrier And Manufacturing Process Thereof App 20070287281 - Wang; Yung-Hui ; et al. | 2007-12-13 |
| Bumping process Grant 7,112,523 - Horng September 26, 2 | 2006-09-26 |
| Bumping process Grant 7,091,121 - Horng August 15, 2 | 2006-08-15 |
| Manufacturing method of a multi-layer circuit board embedded with a passive component App 20060059682 - Horng; Ching-Fu ; et al. | 2006-03-23 |
| Bumping process App 20040266161 - Horng, Ching-Fu | 2004-12-30 |
| Bumping process App 20040266163 - Horng, Ching-Fu | 2004-12-30 |
| Solder paste for fabricating bump Grant 6,692,581 - Tong , et al. February 17, 2 | 2004-02-17 |
| Solder Paste For Fabricating Bump App 20030164204 - Tong, Ho-Ming ; et al. | 2003-09-04 |
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