Horng; Chih-Horng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Horng; Chih-Horng.The latest application filed is for "method for suppressing material warpage by increasing gas density".

Company Profile

0.6.8

Horng; Chih-Horng - Hsinchu TW
Horng; Chih-Horng - Hsinchu City TW
Horng; Chih-Horng - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Suppressing Material Warpage By Increasing Gas Density App 20220246482 - Horng; Chih-Horng	2022-08-04
Device and method for chip pressing Grant 9,196,600 - Horng November 24, 2	2015-11-24
Method for securing a carrier by gas pressurization to inhibit warpage of the carrier Grant 8,893,378 - Horng November 25, 2	2014-11-25
Method For Adjusting Temperature By Increasing Gas Molecular Density App 20140178274 - Horng; Chih-Horng	2014-06-26
Device and Method for Chip Pressing App 20130240115 - Horng; Chih-Horng	2013-09-19
Method for Securing a Carrier by Gas Pressurization to Inhibit Warpage of the Carrier App 20130152363 - Horng; Chih-Horng	2013-06-20
Method for fabricating window ball grid array semiconductor package Grant 7,122,407 - Kim , et al. October 17, 2	2006-10-17
Method for fabricating window ball grid array semiconductor package App 20050208707 - Kim, Sung-Jin ; et al.	2005-09-22
Fabrication method of window-type ball grid array semiconductor package Grant 6,869,824 - Horng March 22, 2	2005-03-22
Fabrication method of window-type ball grid array semiconductor package App 20040082114 - Horng, Chih-Horng	2004-04-29

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