| Patent | Date |
|---|
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 8,936,696 - Lindley , et al. January 20, 2 | 2015-01-20 |
Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction
Grant 8,617,351 - Hoffman , et al. December 31, 2 | 2013-12-31 |
Plasma processing apparatus
Grant 7,972,469 - Hanawa , et al. July 5, 2 | 2011-07-05 |
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor
App 20110115589 - LINDLEY; ROGER ALAN ; et al. | 2011-05-19 |
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 7,879,186 - Lindley , et al. February 1, 2 | 2011-02-01 |
Frequency Doubling Using Spacer Mask
App 20110008969 - Bencher; Christopher D. ; et al. | 2011-01-13 |
Frequency tripling using spacer mask having interposed regions
Grant 7,846,849 - Bencher , et al. December 7, 2 | 2010-12-07 |
Frequency doubling using spacer mask
Grant 7,807,578 - Bencher , et al. October 5, 2 | 2010-10-05 |
Chamber recovery after opening barrier over copper
Grant 7,575,007 - Tang , et al. August 18, 2 | 2009-08-18 |
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor
App 20090008033 - Lindley; Roger Alan ; et al. | 2009-01-08 |
Frequency Tripling Using Spacer Mask Having Interposed Regions
App 20080299465 - BENCHER; CHRISTOPHER D. ; et al. | 2008-12-04 |
Frequency Doubling Using Spacer Mask
App 20080299776 - Bencher; Christopher D. ; et al. | 2008-12-04 |
Plasma Processing Method
App 20080260966 - Hanawa; Hiroji ; et al. | 2008-10-23 |
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
Grant 7,422,654 - Lindley , et al. September 9, 2 | 2008-09-09 |
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor
Grant 7,374,636 - Horioka , et al. May 20, 2 | 2008-05-20 |
Chamber recovery after opening barrier over copper
App 20080050922 - Tang; Hairong ; et al. | 2008-02-28 |
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber
Grant 7,316,199 - Horioka , et al. January 8, 2 | 2008-01-08 |
Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
Grant 7,196,283 - Buchberger, Jr. , et al. March 27, 2 | 2007-03-27 |
Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
App 20050178748 - Buchberger, Douglas A. JR. ; et al. | 2005-08-18 |
Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction
App 20050167051 - Hoffman, Daniel J. ; et al. | 2005-08-04 |
Precision dielectric etch using hexafluorobutadiene
Grant 6,800,213 - Ding , et al. October 5, 2 | 2004-10-05 |
Method of forming a damascene structure
App 20040192051 - Tanaka, Hiroya ; et al. | 2004-09-30 |
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
App 20040182516 - Lindley, Roger Alan ; et al. | 2004-09-23 |
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber
App 20030085000 - Horioka, Keiji ; et al. | 2003-05-08 |
Precision dielectric etch using hexafluorobutadiene
App 20030036287 - Ding, Ji ; et al. | 2003-02-20 |
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor
App 20030006008 - Horioka, Keiji ; et al. | 2003-01-09 |
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
App 20020173162 - Liu, Jingbao ; et al. | 2002-11-21 |
Plasma process apparatus
Grant 5,717,294 - Sakai , et al. February 10, 1 | 1998-02-10 |
Method of manufacturing semiconductor device
Grant 5,707,487 - Hori , et al. January 13, 1 | 1998-01-13 |
Filter manufacturing apparatus
Grant 5,707,501 - Inoue , et al. January 13, 1 | 1998-01-13 |
Magnetron plasma processing apparatus and processing method
Grant 5,660,671 - Harada , et al. August 26, 1 | 1997-08-26 |
Plasma generating apparatus and surface processing apparatus
Grant 5,660,744 - Sekine , et al. August 26, 1 | 1997-08-26 |
Focused ion beam deposition using TMCTS
Grant 5,639,699 - Nakamura , et al. June 17, 1 | 1997-06-17 |
Projectin exposure apparatus
Grant 5,627,626 - Inoue , et al. May 6, 1 | 1997-05-06 |
Method for manufacturing exposure mask and the exposure mask
Grant 5,543,252 - Shibata , et al. August 6, 1 | 1996-08-06 |
Plasma processing apparatus
Grant 5,474,643 - Arami , et al. December 12, 1 | 1995-12-12 |
Method of manufacturing semiconductor device
Grant 5,445,710 - Hori , et al. * August 29, 1 | 1995-08-29 |
Plasma generating device and surface processing device and method for processing wafers in a uniform magnetic field
Grant 5,444,207 - Sekine , et al. August 22, 1 | 1995-08-22 |
Method of manufacturing semiconductor device
Grant 5,437,961 - Yano , et al. August 1, 1 | 1995-08-01 |
Dry etching method
Grant 5,356,515 - Tahara , et al. October 18, 1 | 1994-10-18 |
Plasma etching apparatus
Grant 5,320,704 - Horioka , et al. June 14, 1 | 1994-06-14 |
Dry etching method
Grant 5,310,454 - Ohiwa , et al. May 10, 1 | 1994-05-10 |
Method of manufacturing semiconductor device
Grant 5,302,240 - Hori , et al. April 12, 1 | 1994-04-12 |
Method of etching object to be processed including oxide or nitride portion
Grant 5,302,236 - Tahara , et al. April 12, 1 | 1994-04-12 |
Method for removing composite attached to material by dry etching
Grant 5,298,112 - Hayasaka , et al. March 29, 1 | 1994-03-29 |
Plasma etching apparatus
Grant 5,290,381 - Nozawa , et al. March 1, 1 | 1994-03-01 |
Plasma processing apparatus
Grant 5,271,788 - Hasegawa , et al. December 21, 1 | 1993-12-21 |
Method of adjusting the temperature of a semiconductor wafer
Grant 5,270,266 - Hirano , et al. December 14, 1 | 1993-12-14 |
Dry etching method
Grant 5,259,923 - Hori , et al. November 9, 1 | 1993-11-09 |
Method of manufacturing semiconductor devices including rounding of corner portions by etching
Grant 5,258,332 - Horioka , et al. November 2, 1 | 1993-11-02 |
Plasma treating apparatus
Grant 5,250,137 - Arami , et al. October 5, 1 | 1993-10-05 |
Method of manufacturing semiconductor device
Grant 5,240,554 - Hori , et al. August 31, 1 | 1993-08-31 |
Liquid level detecting device and a processing apparatus
Grant 5,234,527 - Nozawa , et al. August 10, 1 | 1993-08-10 |
Method of selectively forming an insulation layer
Grant 4,595,601 - Horioka , et al. June 17, 1 | 1986-06-17 |
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