Horio; Yasuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Horio; Yasuhiko.The latest application filed is for "structure of non-reciprocal circuit element".

Company Profile

0.7.4

Horio; Yasuhiko - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-reciprocal circuit device, method of manufacturing, and mobile communication apparatus using the same Grant 6,850,751 - Shiiba , et al. February 1, 2	2005-02-01
Structure of non-reciprocal circuit element App 20030231076 - Takeuchi, Takayuki ; et al.	2003-12-18
Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit App 20020097102 - Horio, Yasuhiko ; et al.	2002-07-25
Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit App 20020089392 - Horio, Yasuhiko ; et al.	2002-07-11
Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit App 20020089390 - Horio, Yasuhiko ; et al.	2002-07-11
Non-reciprocal circuit element with ground terminals on one side free of input/output terminals Grant 6,396,361 - Horio , et al. May 28, 2	2002-05-28
Surface wave filter element Grant 5,521,454 - Hattori , et al. May 28, 1	1996-05-28
Method of manufacturing organic substrate used for printed circuits Grant 5,481,795 - Hatakeyama , et al. January 9, 1	1996-01-09
Porous substrate and conductive ink filled vias for printed circuits Grant 5,346,750 - Hatakeyama , et al. September 13, 1	1994-09-13
Method of forming an electrical contact bump Grant 5,090,119 - Tsuda , et al. February 25, 1	1992-02-25
Electrical contact bump and a package provided with the same Grant 5,014,111 - Tsuda , et al. May 7, 1	1991-05-07

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