HORIO; Hirotsugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for HORIO; Hirotsugu.The latest application filed is for "powder for additive manufacturing, and die-casting die part".
- HORIO; Hirotsugu - Nagoya-Shi JP
- Horio; Hirotsugu - Tokai JP
- Horio; Hirotsugu - Toukai JP
| Patent | Date |
|---|---|
| Powder For Additive Manufacturing, And Die-casting Die Part App 20200398339 - IBUKI; Motohiro ; et al. | 2020-12-24 |
| Method for manufacturing joint of carbon steel pipes suitable for expansion and expanding method Grant 6,378,760 - Shimizu , et al. April 30, 2 | 2002-04-30 |
| Metal-pipe bonded body, pipe expansion method of metal-pipe bonded body, and method for inspecting metal-pipe bonded body App 20020014514 - Shimizu, Takao ; et al. | 2002-02-07 |
| Method for evaluating bonding properties of a metallic pipe Grant 6,332,361 - Yamada , et al. December 25, 2 | 2001-12-25 |
| Bonding method of dual phase stainless steel Grant 6,156,134 - Shimizu , et al. December 5, 2 | 2000-12-05 |
| Method of bonding Ti-alloy members Grant 5,699,955 - Shimizu , et al. December 23, 1 | 1997-12-23 |
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