Horimoto; Akihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horimoto; Akihiro.The latest application filed is for "insulating paste".
- Horimoto; Akihiro - Tokyo JP
| Patent | Date |
|---|---|
| Insulating Paste App 20210269618 - Horimoto; Akihiro ; et al. | 2021-09-02 |
| Conductive paste Grant 11,021,626 - Otani , et al. June 1, 2 | 2021-06-01 |
| Conductive Paste App 20200377749 - Otani; Mariko ; et al. | 2020-12-03 |
| Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device Grant 8,148,831 - Horimoto , et al. April 3, 2 | 2012-04-03 |
| Latent Catalyst For Epoxy Resin, Epoxy Resin Composition, And Semiconductor Device App 20090023840 - Horimoto; Akihiro ; et al. | 2009-01-22 |
| Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device App 20070010601 - Horimoto; Akihiro ; et al. | 2007-01-11 |
| Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device App 20050075474 - Horimoto, Akihiro ; et al. | 2005-04-07 |
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