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Patent applications and USPTO patent grants for Horimatsu; Toshiyuki.The latest application filed is for "ea member, and clip and structure for securing the same".
Patent | Date |
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Mold for foam molding and foam molding method Grant 9,186,822 - Sato , et al. November 17, 2 | 2015-11-17 |
EA member, and clip and structure for securing the same Grant 7,966,702 - Horimatsu , et al. June 28, 2 | 2011-06-28 |
Attachment structure of EA component Grant 7,547,061 - Horimatsu , et al. June 16, 2 | 2009-06-16 |
Mounting structure for EA material Grant 7,475,934 - Sato , et al. January 13, 2 | 2009-01-13 |
EA member, and clip and structure for securing the same App 20080263834 - HORIMATSU; Toshiyuki ;   et al. | 2008-10-30 |
EA component and attachment structure of EA component App 20080072405 - Horimatsu; Toshiyuki | 2008-03-27 |
Mold for foam molding and foam molding method App 20070222098 - Sato; Masatoshi ;   et al. | 2007-09-27 |
Mounting structure for EA material App 20070090561 - Sato; Masatoshi ;   et al. | 2007-04-26 |
Ea member attaching construction App 20060125286 - Horimatsu; Toshiyuki ;   et al. | 2006-06-15 |
Rigid polyurethane foam product formed using mold App 20040235972 - Horimatsu, Toshiyuki | 2004-11-25 |
Shock absorbing material App 20040140691 - Horimatsu, Toshiyuki | 2004-07-22 |
Method for mounting shock absorbing material Grant 6,758,937 - Tada , et al. July 6, 2 | 2004-07-06 |
Method for mounting shock absorbing material App 20020064627 - Tada, Shin ;   et al. | 2002-05-30 |
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