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Patent applications and USPTO patent grants for Horikoshi; Eiji.The latest application filed is for "photosensitive, heat-resistant resin composition for forming patterns".
Patent | Date |
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Photosensitive, heat-resistant resin composition for forming patterns Grant 6,045,975 - Tani , et al. April 4, 2 | 2000-04-04 |
Photosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereof Grant 5,972,807 - Tani , et al. October 26, 1 | 1999-10-26 |
Via hole structure and process for formation thereof Grant 5,308,929 - Tani , et al. May 3, 1 | 1994-05-03 |
Circuit board and process for producing same Grant 5,236,772 - Horikoshi , et al. August 17, 1 | 1993-08-17 |
Sintered magnesium-based composite material and process for preparing same Grant 4,941,918 - Horikoshi , et al. July 17, 1 | 1990-07-17 |
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